Micro-nano dual-stage porous copper and preparing method thereof

Abstract

The invention discloses micro-nano dual-stage porous copper. The copper is characterized in that a sintered porous Cu framework serves as a base body, a bicontinuous nano porous structure is formed onthe framework, the average hole diameter of a micro hole ranges from 2.2 micrometers to 3.7 micrometers, the average hole diameter of a nano hole ranges from 60 nm to 113 nm. The preparing method comprises the specific steps that firstly, Cu powder and Mn powder with a certain proportion are evenly mixed and then are pressed into a blank, and are placed in an atmosphere tubular furnace to be subject to temperature rise to a certain temperature, heat preservation is carried out for a certain time, cooling to the room temperature is achieved, and a precursor CuMn alloy is obtained; secondly, the precursor is placed in hydrochloric acid to be subject to dealloying until no obvious bubbles are escaped, and the micro-nano dual-stage porous copper is prepared. The prepared micro-nano dual-stageporous copper has the uniform micro hole / nano hole composite hole structure, a three-dimensional bicontinuous tough belt / hole way structure and the like, the preparing process is short in flow, the method is simple, the structure is controllable, and the functionization production prospect is achieved.

Description

technical field [0001] The invention belongs to the technical field of porous metal preparation, and in particular relates to a micro-nano dual-stage porous copper; the invention also relates to a preparation method of the micro-nano dual-stage porous copper. Background technique [0002] Nanoporous metal materials have nanoscale pores and huge specific surface area, and their unique microstructure makes them have excellent physical and chemical properties, which can be applied in many fields such as catalysis, sensing and fuel cells. The precursor alloy is prepared by powder metallurgy, and the micron pores formed are conducive to the percolation and dealloying of corrosive liquid. The introduction of microporous structures can improve gas-liquid flow and ion exchange, which is expected to further enhance the catalytic sensing performance of nanoporous metals. Cu and Mn form a single solid solution phase after sintering, which is conducive to the formation of a uniform nan...

AI Technical Summary

Problems solved by technology

Chinese patent (publication number: 1068841909A) discloses a method of electrochemical oxidation or thermal oxidation in oxygen combined with electrochemical reduction to prepare hierarchical porous metal materials. The pore structure prepared by this method is composed of metal nanoparticles The formed primary pore aggregates are aggregated again and the secondary pore aggregates formed are connected to each other, but in essence, the two-level pore structure is formed by accumulation, and the metal material does not form a continuous ligament microscopically.

Chinese Patent (Publication No.: 105543531A) and Chinese Patent (Publication No.: 106591619A) respectively disclose methods for preparing two-stage porous copper materials by dealloying copper and aluminum alloys with NaOH and HCl. The organization requirements are high, and the preparation process is relatively complicated

However, the preparation of microporous metal materials by sintering and the preparation of nanoporous metal materials by dealloying have been developed to a relatively high degree in their respective fields, but the design of a material containing two pore structures of sintered micropores and dealloyed nanopores is scarce. There are reports

Images