Polishing pad and method for making same

A manufacturing method and a technology for grinding pads, which are applied in the directions of grinding tools, chemical instruments and methods, abrasives, etc., to achieve the effect of improving productivity and improving grinding performance

Active Publication Date: 2021-07-02
MCK 股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0014] However, the technology disclosed in Korean Laid-Open Patent No. 2003-0063944 still requires the use of slurry, and the technology disclosed in Korean Laid-Open Patent No. 2002-0033203 still requires an adjustment step

Method used

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  • Polishing pad and method for making same
  • Polishing pad and method for making same
  • Polishing pad and method for making same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0113] Embodiment 1. the first grinding body is made

[0114] The first fine particle abrasive material as diamond and the water-soluble solvent are mixed with a ball mill, whereby dispersion is performed without flocculation phenomenon. The dispersed first particulate abrasive material is dried to evaporate the solvent, thereby obtaining the first particulate abrasive material powder.

[0115] Moreover, polyvinyl alcohol (PVA) with a weight average molecular weight of 40,000, polyethylene glycol (PEG) with a weight average molecular weight of 2,000, and dextrin (Dextrin) with a weight average molecular weight of 2,000 and a water-soluble solvent are mixed to make a polymer adhesive. Binder. Wherein, relative to 100 parts by weight of the above-mentioned first particulate abrasive material, the above-mentioned polyvinyl alcohol (PVA) contains 4 parts by weight, polyethylene glycol contains 3 parts by weight, and dextrin contains 3 parts by weight to make a polymer binder.

...

Embodiment 2

[0117] Embodiment 2. the first grinding body is made

[0118] A first abrasive body was produced by the same method as in Example 1 except that 100 parts by weight of silica powder was mixed with respect to the first particulate abrasive material.

Embodiment 3

[0119] Embodiment 3. the first grinding body is made

[0120] A first abrasive body was produced by the same method as in Example 1 except that 200 parts by weight of silica powder was mixed with respect to the first particulate abrasive material.

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Abstract

The present invention relates to a polishing pad and a manufacturing method thereof, and more specifically, to a polishing pad and other manufacturing methods that do not require a slurry and / or an adjustment step during a polishing process. The present invention has the following effects. The polishing pad produced by the present invention is coated with a self-regulating molded body with water-based polyurethane, thereby controlling the dissolution rate. An additional adjustment process, so there is no idle time of the device, which increases the productivity of the grinding process. Also, the present invention has the effect that the polishing pad produced by the present invention includes polishing auxiliary materials, thereby improving polishing performance.

Description

technical field [0001] The present invention relates to a polishing pad and a manufacturing method thereof, and more specifically, to a polishing pad and other manufacturing methods that do not require the use of slurry and / or the need for a conditioning process during the polishing process. Background technique [0002] Sodalime glass (Sodalime glass), borosilicate glass (Borosilicate glass), aluminosilicate glass (Aluminosilicate glass), quartz (Quartz ) and other materials to form flat optical glass substrates, sapphire (Sapphire), silicon carbide (SiC), zirconia (Zirconia) wafer substrates, including grinding (Grinding), lapping (Lapping), polishing (Polishing) and finishing (Finishing) and other grinding processes are one of the core processes. [0003] The polishing step adjusts the thickness of the substrate of the object to be polished, or the surface roughness (Surface Roughness) of the substrate surface. [0004] Grinding is a step that mainly reduces the thickne...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24D3/22
CPCB24D3/22B24B37/24C08L75/04C08L101/00C09K3/1409C09K3/1436
Inventor 文德柱赵始衡朴晟镐朴兑镇徐荣吉
Owner MCK 股份有限公司
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