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Printed circuit board manufacturing method

A printed circuit board and manufacturing method technology, applied in the directions of printed circuit manufacturing, printed circuit, printed circuit secondary processing, etc., can solve the problems of easily damaged printed circuit boards, reduced enterprise profits, long production cycle, etc. Reasonable process design, low production cost and short production cycle

Inactive Publication Date: 2018-06-05
HANGZHOU TIANFENG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The current production process of printed circuit boards has a long production cycle, complicated procedures, high cost, and complicated procedures are easy to damage printed circuit boards, resulting in a high scrap rate in the production process, thereby reducing the profit of the enterprise

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] A method for manufacturing a printed circuit board, comprising the steps of:

[0041] S1. Grinding board: Use a brush stick to brush and grind the surface of the printed circuit board substrate. During the grinding process, spray the printed circuit board substrate with water. After the grinding board is completed, dry it with hot air. The temperature of the hot air is 35-55 ℃, until the water vapor is completely dried.

[0042] S2. Line screen printing: place the line screen printing screen on the screen frame of the printing machine, align the screen frame with the printed circuit board and fix the screen frame with locking screws, and pour the ink that has been stirred and left still into the screen evenly. Printing is carried out in the frame. After the printing is completed, the printed circuit board substrate needs to be light-cured, using LED lamps as the light source, and the UV energy is >650mj / cm when light-curing 2 , the light curing speed is 3-5m / min; the b...

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PUM

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Abstract

The invention relates to a printed circuit board manufacturing method, which is characterized by comprising the following steps of board grinding, line screen printing, etching, board grinding beforesolder mask, solder mask screen printing, character screen printing, CCD drilling, punching, electrical measurement, OSP and finished product inspection. The manufacturing process of the printed circuit board has a reasonable processing procedure, short production cycle, low production cost, high yield, stable product quality, consistent quality and high circuit reliability, and good development space for integration, miniaturization and product automation of electronic equipment is provided.

Description

technical field [0001] The invention relates to the technical field of PCB product manufacturing, in particular to a method for manufacturing a printed circuit board. Background technique [0002] Printed circuit board (PCB circuit board), also known as printed circuit board, is the provider of electrical connections for electronic components. Its development has a history of more than 100 years. Its design is mainly layout design, and the main advantage of using circuit boards is that it greatly reduces wiring and assembly errors, and improves the automation level and production labor rate. Printed circuit boards have developed from single-layer to double-sided, multi-layer and flexible boards, and are constantly developing in the direction of high precision, high density and high reliability. Continuous reduction in size, cost reduction, and performance improvement enable printed circuit boards to maintain strong vitality in the development of future electronic products....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/12H05K3/28
CPCH05K3/00H05K3/1216H05K3/28H05K2203/0139H05K2203/052
Inventor 吴民
Owner HANGZHOU TIANFENG ELECTRONICS CO LTD
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