Formula of acid plating solution for rhenium iridium alloy coating on surface of glass die and preparation method thereof
A technology of alloy coating and acid plating solution, which is applied in the field of acid plating solution formulation and preparation of rhenium-iridium alloy coating on the surface of glass molds, which can solve the problems of high equipment cost and high preparation cost, and achieve low cost and uniform distribution of components , the effect of excellent corrosion resistance
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Embodiment 1
[0016] Prepare 50mL of plating solution, ammonium perrhenate 0.05mol / L, sodium hexabromoiridate 0.045mol / L, chloroiridic acid hydrate 0.005mol / L, without adding any additives and complexing agents, drop 3mol / L Sodium hydroxide solution to adjust the pH of the plating solution to 5.0, add 0.05mol / L potassium chloride, the deposition temperature is 70°C, and the current density is 50mA / cm 2 ; Conduct constant current electrochemical deposition of rhenium-iridium alloy coating on the surface of the copper electrode. The copper electrode is initially ultrasonically cleaned for larger organic matter, and then the surface oxide is removed in a dilute nitric acid solution. Finally, it is cleaned in acetone or ethanol and blown cold. blow dry. Before plating, a layer of nickel thin film is applied on the surface of the copper substrate, and the plating is carried out. During the plating process, the distance between the workpiece electrode and the platinum sheet of the auxiliary elec...
Embodiment 2
[0018] Prepare 50mL electrolyte, ammonium perrhenate 0.05mol / L, sodium hexabromoiridate 0.045mol / L, chloroiridic acid hydrate 0.01mol / L, complex citric acid 0.045mol / L, additive is sulfuric acid 0.02mol / L, drop 3mol / L sodium hydroxide solution to adjust the pH of the plating solution to 5.0, set the deposition temperature to 70°C, and the current density to 50mA / cm 2 Conduct constant current electrodeposition of rhenium-iridium alloy on the surface of the copper electrode. The copper electrode is initially ultrasonically cleaned for organic matter, and then the surface oxide is removed in a diluted nitric acid solution, and finally cleaned in acetone or ethanol, and dried with cold air. The distance between the workpiece electrode and the auxiliary electrode platinum sheet is about 0.5cm, the deposition time is 30min, the quality of the coating is good, the current conversion efficiency of the alloy is 55%, the thickness of the coating is 5.1um, and the iridium content in the ...
Embodiment 3
[0020] Plating solution formula: ammonium perrhenate 0.043mol / L, sodium hexabromoiridate 0.040mol / L, chloroiridic acid hydrate 0.010mol / L, complex oxalic acid 0.0375mol / L, additive is hydrofluoric acid 0.005mol / L, configure 50mL plating solution, drop 0.02mol / L sulfuric acid solution to adjust the pH of the plating solution to 2.0, add 0.01mol / L potassium chloride, set the deposition temperature to 70°C, and the current density to 100mA / cm 2 ; Conduct constant current electrochemical deposition of rhenium-iridium alloy coating on the surface of mold steel electrodes, and the copper electrodes are preliminarily cleaned by ultrasonic cleaning of larger organic matter, then the surface oxides are removed and activated in sulfuric acid solution, and finally cleaned in acetone or ethanol , blow dry with cold air. Before plating, a layer of chromium film is applied on the surface of the mold steel electrode, and the plating is carried out. The distance between the workpiece electr...
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