Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Production technology of high-tenacity copper-clad laminated board with low CTE and high breakage voltage

A technology of copper-clad laminates and high breakdown voltage, which is applied in the field of copper-clad laminates, can solve the problems of poor PCB processing performance, low interlayer bonding strength, and board toughness to be improved, achieving low CTE, Effect of high breakdown voltage and improved processability

Inactive Publication Date: 2018-06-01
GUANGDE LONGTAI ELECTRONICS SCI TECH
View PDF4 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, when the existing copper clad laminates are machined, the interlayer bonding strength is not high, and the PCB processing performance is poor. The mechanical processing performance, that is, the toughness of the board needs to be improved.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Production technology of high-tenacity copper-clad laminated board with low CTE and high breakage voltage
  • Production technology of high-tenacity copper-clad laminated board with low CTE and high breakage voltage
  • Production technology of high-tenacity copper-clad laminated board with low CTE and high breakage voltage

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] The technical solution adopted in the present invention is: a production process of a copper-clad laminate with low CTE, high breakdown voltage and high toughness. The production process of the copper-clad laminate comprises the following steps:

[0021] 1). Set the resin glue formula: first transfer the raw materials of the resin glue formula used in the production of copper-clad laminates into the high-speed disperser, and fully mix and stir at a high-speed stirring rate inside the high-speed disperser for 4.5 hours until the mixture is mixed. Uniform, and the test shows that the gelation time of the resin glue is 350s;

[0022] 2). Adjust the production parameters of P sheet: glue the evenly mixed resin glue solution obtained in step 1 on 7628 glass fiber cloth, the resin content after gluing is 43%, and dry it in a vertical gluing machine. Prepreg;

[0023] 3). Adjust the pressing molding process: then stack 8 sheets of prepreg, then laminate them with copper foil,...

Embodiment 2

[0031] The technical solution adopted in the present invention is: a production process of a copper-clad laminate with low CTE, high breakdown voltage and high toughness. The production process of the copper-clad laminate comprises the following steps:

[0032] 1). Set the resin glue formula: first transfer the raw materials of the resin glue formula used in the production of copper-clad laminates into the high-speed disperser, and fully mix and stir at a high-speed stirring rate in the high-speed disperser for 6 hours until the mixture is uniform , and test the gelation time of the resin glue;

[0033] 2). Adjust the production parameters of P sheet: glue the evenly mixed resin glue solution obtained in step 1 on 7628 glass fiber cloth, the resin content after gluing is 45%, and dry it in a vertical gluing machine. Prepreg;

[0034] 3). Adjust the pressing molding process: Then stack 9 prepregs, then laminate them with copper foil, and press them in a vacuum press to form th...

Embodiment 3

[0042] The technical solution adopted in the present invention is: a production process of a copper-clad laminate with low CTE, high breakdown voltage and high toughness. The production process of the copper-clad laminate comprises the following steps:

[0043] 1). Set the resin glue formula: first transfer the raw materials of the resin glue formula used in the production of copper-clad laminates into the high-speed disperser, and fully mix and stir at a high-speed stirring rate inside the high-speed disperser for 4 hours until the mixture is uniform , and test the gelation time of the resin glue;

[0044] 2). Adjust the production parameters of P sheet: apply the uniformly mixed resin glue solution obtained in step 1 to 7628 glass fiber cloth, the resin content after gluing is 48%, and dry it in a vertical gluing machine. Prepreg;

[0045] 3). Adjust the pressing molding process: then stack 10 sheets of prepreg, then laminate them with copper foil, and press them in a vacuu...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Dynamic viscosityaaaaaaaaaa
Dynamic viscosityaaaaaaaaaa
Dynamic viscosityaaaaaaaaaa
Login to View More

Abstract

The invention relates to a production technology of a high-tenacity copper-clad laminated board with low CTE and high breakage voltage. The production technology of the copper-clad laminated board comprises the following steps: setting the formula of a resin glue solution, adjusting P sheet production parameters and adjusting a compression molding technology, specifically firstly sufficient and uniformly mixing raw materials of the formula of the resin glue solution used for producing the copper-clad laminated board, then gluing the uniformly mixed resin glue solution onto electronic grad glass fiber cloth, drying the resin glue solution on a vertical gluing machine to obtain prepregs, then laminating two to ten prepregs, then overlapping a copper foil, carrying out compression molding inside a vacuum pressing machine, and finally packaging the prepared copper-clad laminated board for shipment after the testing for the appearance and inner materials of the board is qualified. The boardafter compression molding manufactured through the production technology of the copper-clad laminated board has the characteristics of low CTE and high breakage voltage, and through modification of the formula, the tenacity and durability of the board are greatly improved, so that the PCB processing performance is greatly improved.

Description

technical field [0001] The invention relates to the technical field of copper-clad laminates, in particular to a production process for copper-clad laminates with low CTE, high breakdown voltage and high toughness. Background technique [0002] With the rapid development of electronic products, the requirements for integration are getting higher and higher, and the size of components is shrinking, the number of devices per unit area is increasing, the circuit is becoming more and more complex, and the span of the application environment is also increasing. Copper plates have a lower coefficient of thermal expansion (CTE), higher toughness, and higher breakdown voltage to improve interconnection and installation reliability. [0003] At present, when the existing copper clad laminates are machined, the interlayer bonding strength is not high, and the PCB processing performance is poor. The mechanical processing performance, that is, the toughness of the board needs to be impr...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): B32B37/10B32B37/06B32B37/12B32B38/00C08L79/04C08L63/00C08L61/06C08K3/22H05K3/02
CPCH05K3/022C08L79/04B32B37/06B32B37/1018B32B37/1284B32B38/164C08K2003/2227C08L2205/03B32B2457/08B32B2307/20B32B2307/734B32B2307/558C08L63/00C08L61/06C08K3/22
Inventor 陈伟福林英荣巴晶
Owner GUANGDE LONGTAI ELECTRONICS SCI TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com