A packaging structure for a direct-lit backlight source and a manufacturing method thereof

A technology of encapsulation structure and manufacturing method, which is applied in optics, nonlinear optics, instruments, etc., can solve problems such as water and oxygen infiltration at the edge, degradation of quantum dot luminous performance, and failure to consider luminous efficiency, etc., to achieve complete structure and function, Good water and oxygen barrier ability, good light guide effect

Active Publication Date: 2020-09-01
FUZHOU UNIV
View PDF14 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The quantum dots in the first two methods will work at high temperature and be exposed to intense light excitation, which significantly reduces the quantum efficiency and lifetime of the quantum dots, therefore, packaging issues and material reliability must be addressed first
Although the third type encapsulates the quantum dots with a film, it uses a low water-permeable polymer film to encapsulate the quantum dots, and this technology of encapsulating the quantum dots with a polymer film still has marginal water and / or oxygen penetration The problem
In CN105068314 A, the researchers proposed a direct-type backlight module, which made quantum dots into a quantum dot film, but it did not take into account the ability of the quantum dot film material to block water and / or oxygen in the air to affect the quantum dots. The problem of luminous efficiency, that is, without considering the encapsulation material of quantum dots, the luminous performance of quantum dots will decrease under long-term exposure to air and light stimulation

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A packaging structure for a direct-lit backlight source and a manufacturing method thereof
  • A packaging structure for a direct-lit backlight source and a manufacturing method thereof
  • A packaging structure for a direct-lit backlight source and a manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] figure 1 It shows the packaging structure for direct type quantum dot backlight, which includes substrate layer 1, barrier layer 2, red quantum dots 3, green quantum dots 4, packaging layer 5, blue light source 6, optical film 7 , reflective layer 8 . exist figure 1 In the first basic structure shown in , the quantum dot microstructure array dimming layer is composed of quantum dots and composite materials. The quantum dot microstructure array contains one or more quantum dots and composite materials with a central wavelength between 380-780nm. It is made of quantum dot slurry by mixing quantum dots and composite materials in a certain proportion. Depending on requirements, the quantum dot microstructure array is formed by methods such as inkjet printing, and the thickness of the quantum dot microstructure array is 20-50 μm. Outside the dimming layer of the quantum dot microstructure array is the encapsulation layer, which is made of inorganic materials such as silic...

Embodiment 2

[0039] Figure 4 It shows the packaging structure for direct type quantum dot backlight, which includes substrate layer 1, barrier layer 2, red quantum dots 3, green quantum dots 4, packaging layer 5, blue light source 6, optical film 7 , reflective layer 8 . Figure 4 On the basis of Embodiment 1, grooves are formed on the lower surface of the substrate by methods such as photolithography, erosion or laser etching. The quantum dot microstructure array dimming layer is composed of quantum dots and composite materials. The configuration and formation of the quantum dot microstructure array are similar to those in Embodiment 1 of the present invention, and will not be repeated here. The only difference is that after the groove is formed, the inclined walls on both sides inside the groove are coated with high reflectivity materials by spraying, evaporation, etc., so that the light of the direct light source can all be emitted from the microstructure, and has a certain Directivi...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
surface tensionaaaaaaaaaa
particle sizeaaaaaaaaaa
thicknessaaaaaaaaaa
Login to view more

Abstract

The invention provides a package structure for a direct type backlight and a making method of the package structure. The package structure is of a laminated structure and comprises a barrier layer, aquantum-dot micro-structure array dimming layer, a packaging layer and a reflecting layer. The package structure is made by using a full ink-jet printing manufacturing technology process including thespecific steps that a substrate is pretreated to form the barrier layer; evenly mixed quantum-dot stock is printed on the lower surface of the substrate by using a scanning type ink-jet printing method and solidified to form the dimming layer; a layer of transparent barrier material is printed on the substrate with quantum dots in a point-to-point ink-jet mode, and solidified to form the packaging layer, and then a high-reflectivity material is attached to the outer edge in a mode of spray coating or evaporation to form the reflecting layer. By means of the package structure, the package problem of discrete distribution of a direct type quantum-dot micro-structure array is solved; compared with other package forms, the package structure has the advantages of being complete in function, simple in structure and process and capable of reducing cost, and the package structure can be further applied and popularized in other lighting fields.

Description

technical field [0001] The invention relates to a packaging structure for a direct-type quantum dot backlight source and a manufacturing method thereof, and belongs to the technical field of quantum dot deviceization. [0002] technical background [0003] In recent years, with the progress of scientific research, quantum dot semiconductor materials and their products have gradually entered people's field of vision. Quantum dots, also known as semiconductor nanocrystals, generally have a size between 1-10nm, and have spectral characteristics such as wide excitation spectrum, symmetrical distribution and narrow width of emission spectrum, adjustable color, and high photochemical stability. White light can be generated by using a blue light-emitting diode to excite a mixture of red and green quantum dots. Quantum dots are widely used in electroluminescent devices, photoluminescent devices, displays, solid-state lighting, biomedicine and other fields. Due to the strong size dep...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): G02F1/13357
CPCG02F1/133602G02F1/133614
Inventor 陈恩果叶芸徐胜郭太良林金堂林志贤谢洪兴
Owner FUZHOU UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap