Water-based organic paste and aluminum solder paste comprising paste
A paste-forming, water-based technology, applied in the treatment of dyed low-molecular organic compounds, dyed high-molecular organic compounds, welding media, etc., can solve the problems of residual carbon deposition, smoke generation, environmental protection, etc., and achieve improved anti-settling performance , The effect of increasing the viscosity of the system and improving the fineness
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Embodiment 1
[0042] An embodiment of the water-based organic paste of the present invention, the water-based organic paste of the present embodiment comprises the following components in mass percentage:
[0043] Water-based organic solvent and water-based polymer (ethylene glycol: copovidone = 89:11) 94%, surfactant (octylphenol polyoxyethylene ether) 5%, chemical passivator (triethanolamine borate) 1%.
[0044] In this embodiment, an aluminum solder paste comprising the aqueous organic paste, the mass percentage of the aqueous organic paste in the aluminum solder paste is 30%, and the aluminum flux, aluminum solder The total mass percentage in the aluminum solder paste is 70%, the weight ratio of the aluminum brazing flux to the aluminum brazing filler metal is: aluminum brazing flux: aluminum brazing filler metal = 1:1, and the aluminum brazing flux is fluorine Potassium aluminate, the melting temperature of the aluminum solder is 550-570° C.; the aluminum solder is an aluminum-silicon...
Embodiment 2
[0046] An embodiment of the water-based organic paste of the present invention, the water-based organic paste of the present embodiment comprises the following components in mass percentage:
[0047] Water-based organic solvent and water-based polymer (propylene glycol: carboxymethyl cellulose = 92:8) 89.7%, surfactant (sorbitan monolaurate) 6.3%, chemical deactivator (benzotriazole) 4.0%.
[0048] In this embodiment, an aluminum solder paste comprising the aqueous organic paste, the mass percentage of the aqueous organic paste in the aluminum solder paste is 40%, the aluminum flux, aluminum solder The total mass percentage in the aluminum solder paste is 60%, the weight ratio of the aluminum brazing flux to the aluminum brazing filler metal is: aluminum brazing flux: aluminum brazing filler metal = 1:5.0, and the aluminum brazing flux is fluorine Potassium aluminate, the melting temperature of the aluminum solder is 550-570°C; the aluminum solder is an aluminum-silicon alloy...
Embodiment 3
[0050] An embodiment of the water-based organic paste of the present invention, the water-based organic paste of the present embodiment comprises the following components in mass percentage:
[0051] Water-based organic solvent and water-based polymer (triethylene glycol: hydroxypropyl cellulose = 95:5) 88.0%, surfactant (sorbitan monostearate) 7.0%, chemical passivator (benzotri azole) 5.0%.
[0052] In this embodiment, an aluminum solder paste comprising the water-based organic paste, the mass percentage of the water-based organic paste in the aluminum solder paste is 35%, the aluminum flux, aluminum solder The total mass percentage in the aluminum solder paste is 65%, the weight ratio of the aluminum brazing flux to the aluminum brazing filler metal is: aluminum brazing flux: aluminum brazing filler metal = 1:2.5, and the aluminum brazing flux is fluorine Potassium aluminate, the melting temperature of the aluminum solder is 550-570° C.; the aluminum solder is an aluminum-...
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