Negative temperature coefficient thermistor with nano particle film, and preparation method thereof
A negative temperature coefficient, thermistor technology, applied in the direction of resistors with negative temperature coefficients, resistance terminals/electrodes, etc., can solve the problem of weak electrode protection, the influence of the performance of the base element, and the weak adhesion of glass and electrode layers, etc. problem, to achieve the effect of increasing the bonding strength
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Embodiment 1
[0024] A method for preparing a negative temperature coefficient thermistor with a nano-particle film includes the following steps:
[0025] (1) First soak the ceramic substrate with 5% hydrofluoric acid for 5 minutes, and then ultrasonically clean it with acetone, alcohol and deionized water for 10 minutes. After cleaning, it is purged with nitrogen and sealed for use;
[0026] (2) Use pre-sputtering to remove the oxide layer on the surface of the ceramic substrate, and then coat a layer of metallic nickel to form a transition layer, where the thickness of the nickel layer is 0.2 μm;
[0027] (3) Using magnetron sputtering to sputter a layer of metallic copper on the transition layer to form a copper electrode layer, the thickness of the copper electrode layer is 2 μm;
[0028] (4) After the copper electrode in step (3) is connected to the pins, a layer of nano aluminum film is sputtered on the surface of the copper electrode layer by magnetron sputtering. The substrate temperature fo...
Embodiment 2
[0031] A method for preparing a negative temperature coefficient thermistor with a nano-particle film includes the following steps:
[0032] (1) First soak the ceramic substrate with 5% hydrofluoric acid for 5 minutes, and then ultrasonically clean it with acetone, alcohol and deionized water for 10 minutes. After cleaning, it is purged with nitrogen and sealed for use;
[0033] (2) Use pre-sputtering to remove the oxide layer on the surface of the ceramic substrate, and then coat a layer of metallic nickel to form a transition layer, the thickness of the nickel layer is 0.5 μm;
[0034] (3) Using magnetron sputtering to sputter a layer of metallic copper on the transition layer to form a copper electrode layer, the thickness of the copper electrode layer is 1 μm;
[0035] (4) After the copper electrode in step (3) is connected to the pins, a layer of nano aluminum film is sputtered on the surface of the copper electrode layer by magnetron sputtering. The substrate temperature of the n...
Embodiment 3
[0038] A method for preparing a negative temperature coefficient thermistor with a nano-particle film includes the following steps:
[0039] (1) First soak the ceramic substrate with 5% hydrofluoric acid for 5 minutes, and then ultrasonically clean it with acetone, alcohol and deionized water for 10 minutes. After cleaning, it is purged with nitrogen and sealed for use;
[0040] (2) Using magnetron sputtering to sputter a layer of metallic copper on the surface of the ceramic substrate to form a copper electrode layer, the thickness of the copper electrode layer is 1 μm;
[0041] (3) After connecting the copper electrode in step (2) to the pins, a layer of nano aluminum film is sputtered on the surface of the copper electrode layer by magnetron sputtering. The substrate temperature for sputtering the nano aluminum film is 100°C. The air pressure used is 2Pa,
[0042] Sintering in a weak oxidizing atmosphere, the thickness of the nano aluminum oxide film formed is 200 nm.
[0043] In th...
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