A kind of electronic device heat dissipation method of array jet, solid-liquid phase change coupling

Abstract

The invention belongs to the technical field of electronic device heat dissipation methods, and particularly relates to an array jet and solid-liquid phase change coupling-based electronic device heatdissipation method. The method solves a high heat flux heat dissipation problem of a high-power electronic device. The method is carried out through an array jet structure, a flow working medium forthe method is a phase change nano capsule suspension, and the phase change nano capsule suspension and a target object exchange heat, so as to control the temperature of the target object. According to the method, the phase change nano capsule suspension is used in submerged array jet impact heat exchange, solid-liquid phase change heat exchange of a phase change capsule core and a disturbance action of a nano capsule particle can improve the heat exchange performance of the array jet remarkably, so as to meet the heat dissipation demand of the target object under a high heat flux condition. The solid-liquid phase change enhanced heat exchange manner used in the invention is relatively stable, and the heat dissipation structure is simpler.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation methods for electronic devices, and in particular relates to a heat dissipation method for electronic devices coupled with array jets and solid-liquid phase transitions. Background technique [0002] With the continuous development of micromachining level, electronic devices are gradually developing towards the direction of miniaturization, high integration and high operating frequency, which makes the heat flux density increase rapidly during operation, which can be as high as 100W / cm 2 , therefore, adopting an efficient and reliable cooling scheme to achieve thermal control of electronic devices is crucial to ensure their safe operation. [0003] The jet impingement is to impinge the flowing working fluid on the target object through the nozzle at high speed. Due to the high-speed action of the fluid, the boundary layer near the stagnation point of the target object is very thin, which ...

AI Technical Summary

Problems solved by technology

Although the heat exchange effect of this method is significantly improved, because it adopts the gas-liquid phase change method, the pressure of the working medium needs to be controlled within a certain range, so the overall sealing performance of the device is high; at the same time, the gas-liquid phase change process is not easy to be stable. , it is difficult to control, and the power consumption of the system voltage drop is relatively large, so it is difficult to realize the project

Images