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Preparing method of low-temperature nano copper welding material

A welding material and nano-copper technology, applied in the direction of welding/cutting medium/material, welding equipment, welding medium, etc., can solve problems such as increased melting point, danger, and complexity

Inactive Publication Date: 2018-01-09
GUANGDONG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] However, nano-copper has the defect of being easily oxidized
Especially for some conductive copper pastes that need to be sintered at low temperature, the oxidation of copper will cause the melting point to increase, resulting in sintering failure
Therefore, during the sintering process, a protective atmosphere is often required, which is dangerous and complicated.
Or use a protective agent such as PVP to protect nano-copper from oxidation, but it will have a great impact on the conductivity of the sintered material

Method used

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  • Preparing method of low-temperature nano copper welding material

Examples

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preparation example Construction

[0020] The present invention provides a kind of preparation method of nano-copper welding material for low temperature, comprising the following steps:

[0021] mixing the resin and organic alcohol to obtain a resin carrier;

[0022] Mix the resin carrier with organic acid and nano-copper, stir until the nano-copper is evenly dispersed, then mix evenly with heat-resistant plastic agent, and grind to obtain nano-copper welding material for low temperature;

[0023] The organic acid is selected from adipic acid, oxalic acid, malonic acid, succinic acid, sebacic acid, pimelic acid, malic acid, succinic acid, glutaric acid, dimethylglutaric acid, o-hydroxybenzoic acid , one or more of phthalic acid, salicylic acid and itaconic acid.

[0024] The invention mixes the resin and the organic alcohol to obtain the resin carrier. In the present invention, the resin is preferably selected from one or more of epoxy resins, phenolic resins, acrylic resins and silicone resins; more prefera...

Embodiment 1

[0034] Epoxy resin E-51 10 mass parts, triethylene glycol 20 mass parts, stir and mix uniformly; Add the phthalic acid of 5 mass parts, mix homogeneously, add the nano-copper powder (30nm) 60 mass parts of ethanol solvent protection, 700rpm After stirring for 30 minutes, 5 parts by mass of polypropylene were added; after mixing with a three-roller mill, a nano brazing material for low-temperature sintering was obtained.

[0035] The method provided in Example 1 can effectively prevent or reduce the oxidation of copper nanoparticles during use and improve the conductivity of the welding material. In addition, the soldering material can also clean the soldered copper surface, improving product reliability. The organic acid itself will be gradually consumed during the sintering process, which can achieve the effect of no-cleaning welding material residues.

Embodiment 2

[0037] 8 mass parts of phenolic resin, 15 mass parts of Polyethylene Glycol, stirring and mixing; Add the dimethyl glutaric acid of 6 mass parts, mix homogeneously, add the nano-copper powder (50nm) 65 mass parts of propanol solvent protection, 800rpm Stirring at low temperature for 25 minutes; adding 6 parts by mass of vinyl cellulose; and mixing with a three-roll mill to obtain nano-brazing material for low-temperature sintering.

[0038] The method provided in Example 2 can effectively prevent or reduce the oxidation of copper nanoparticles during use and improve the conductivity of the welding material. In addition, the soldering material can also clean the soldered copper surface, improving product reliability. The organic acid itself will be gradually consumed during the sintering process, which can achieve the effect of no-cleaning welding material residues.

[0039]As can be seen from the above examples, the present invention provides a method for preparing a low-temp...

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Abstract

The invention provides a preparing method of a low-temperature nano copper welding material. The method comprises the steps that resin and organic alcohol are mixed, and a resin carrier is obtained; the resin carrier, the organic alcohol and nano copper are mixed, stirring is carried out until the nano copper is evenly dispersed, then, a mixture is evenly mixed a heat-resisting shaping agent, grinding is carried out, and the low-temperature nano copper welding material is obtained; the organic acid is selected from one or multiple of adipic acid, oxalic acid, malonic acid, succinic acid, sebacic acid, pimelic acid, malic acid, succinic acid, glutaric acid, dimethyl glutaric acid, o-hydroxybenzoic acid, phthalic acid, salicylic acid and itaconic acid. The manner that the resin, the organicalcohol and the organic acid are adopted to serve as a flux to be mixed with the nano copper, and the welding material is prepared is adopted, the organic acid is used, oxidization of the nano copperin the use process can be effectively prevented or reduced, and conductivity of welding materials can be improved; the welding materials can clean the welding copper face, and product reliability is improved; in the sintering process, the organic acid is gradually dissipated, and the effect that the welding material residue do not need to be cleaned is achieved.

Description

technical field [0001] The invention relates to the technical field of welding materials, in particular to a preparation method of nano-copper welding materials for low temperature. Background technique [0002] Solder paste is a widely used soldering material in the electronics industry. However, with the expansion of the application field of electronic products, the traditional solder paste has many problems, such as short circuit caused by tin whisker phenomenon, failure of Cu element, pad fracture failure caused by pure intermetallic compound, poor vibration and impact resistance, etc. question. In addition, the use temperature of solder paste is relatively high, and some Si-based products cannot meet the requirements of low temperature use. [0003] The melting point of small-sized nanoparticles is much lower than their bulk materials, and the temperature of their connection area is lower than their melting point. After sintering, the overall thermal stability will be...

Claims

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Application Information

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IPC IPC(8): B23K35/30B23K35/363
Inventor 崔成强张昱赖韬杨斌
Owner GUANGDONG UNIV OF TECH
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