Aluminum alloy electronic chip tray and preparation process thereof
A technology of electronic chip and preparation process, which is applied in the manufacture of circuits, electrical components, semiconductors/solid-state devices, etc. It can solve the problems of high appearance quality and product flatness, poor impact resistance, and short service life of aluminum alloy die-casting parts. problems, to achieve the effect of good appearance quality, small thermal deformation and good corrosion resistance
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Embodiment 1
[0053] In the pulping process, the ADC12 aluminum alloy material is selected for the preparation of semi-solid slurry. The aluminum alloy raw material is smelted in a smelting furnace, refined and degassed, and then a liquid alloy is obtained. As a pulping equipment, the liquid alloy in the spoon is mechanically stirred during the cooling process, and the mechanical stirring speed is 1200 rpm to obtain a semi-solid slurry with spherical crystals; the temperature of the semi-solid slurry is 595 ℃, and the solid phase ratio Is 43%;
[0054] In the rheological die-casting process, the above semi-solid slurry is filled into the mold cavity under the action of the die-casting machine. The mold cavity roughness Ra is 1.8μm; the matching gap of the mold parting surface is 0.02mm. After the filling is completed, increase the pressure, and Vacuum die-casting is performed to obtain a die-casting blank; wherein the cavity vacuum is 60mbar, the pumping time is 0.5s, and the boost pressure is...
Embodiment 2
[0057] In the pulping process, the ADC12 aluminum alloy material is selected for the preparation of semi-solid slurry. The aluminum alloy raw material is smelted in a smelting furnace, refined and degassed, and then a liquid alloy is obtained. As a pulping equipment, the liquid alloy in the spoon is mechanically stirred during the cooling process. The mechanical stirring speed is 1200 rpm to prepare a semi-solid slurry with spherical crystals; the temperature of the semi-solid slurry is 600 ℃, and the solid phase The rate is 42%;
[0058] In the rheological die-casting process, the semi-solid slurry is filled into the mold cavity under the pressure of the die-casting machine. The mold cavity roughness Ra is 1.8μm; the matching gap of the mold parting surface is 0.02mm. Increase the pressure after the filling is completed, and Vacuum die-casting is performed to obtain a die-casting blank; wherein the cavity vacuum is 60mbar, the pumping time is 0.5s, and the boost pressure is 240M...
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