Method for in-situ enhancement of high-temperature oxidation resistance of Cu-Cr-Zr alloy

Abstract

The invention discloses a method for in-situ enhancement of high-temperature oxidation resistance of Cu-Cr-Zr alloy. The method is characterized in that equal channel angular pressing treatment is performed on the Cu-Cr-Zr alloy subjected to solution treatment, lots of dislocation defects in dispersed distribution are formed in the alloy material, the defects serve as nucleation points for precipitation of second-phase particles during follow-up subzero treatment, and dispersed distribution of precipitated phases is facilitated; during subzero treatment, thermodynamic conditions of the precipitation process are regulated and controlled to enable the dislocation defects to serve as the nucleation points, so that the nucleation activation energy is reduced; and during subzero treatment, dynamic conditions of the precipitation process are regulated and controlled to control the situations that the precipitation driving force under the subzero conditions is increased and the atomic diffusion transfer capability is reduced, and the Cu-Cr-Zr alloy with high-temperature oxidation resistance is obtained after subzero treatment. Compared with the prior art, through technological and parameter optimization, the precipitation behaviors of the precipitation phases are finely regulated and controlled, uniform and compact nano-particles are subjected to in-situ precipitation, and the high-temperature oxidation resistance of the Cu-Cr-Zr alloy is optimized for the first time.

Description

Technical field [0001] The invention belongs to the technical field of non-ferrous metal processing, and in particular relates to a method for in-situ strengthening the high-temperature oxidation resistance of a copper-chromium-zirconium alloy. Background technique [0002] With the development of power devices and the improvement of IC integration, lead frame materials need to have higher electrical conductivity, thermal conductivity, oxidation resistance and excellent mechanical properties, especially excellent oxidation resistance at high temperatures. It is especially worth noting that in the existing soldering process in the industry, the connection between the chip and the lead frame usually needs to be heated to a temperature above a certain temperature (the temperature refers to the melting point of the solder), in order to avoid the oxidation of the copper-based lead frame. Welding defects often require reducing gas (95%N 2 +5%H 2 Synthetic gas, that is, a mixture of nit...

AI Technical Summary

Problems solved by technology

As a copper alloy material, copper-chromium-zirconium alloy still faces the problem of high-temperature oxidation, and there is no research on how to improve its own high-temperature oxidation resistance by optimizing the alloy microstructure

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