Copper strip preparation process for high-end frame material

Abstract

Provided is a copper strip preparation process for a high-end frame material. According to the weight percentage of components in a smelting furnace, the total content of standard electrical cathode copper and Cu in all alloys is 96.5% or above, iron Fe accounts for 2.1-2.6%, phosphor P accounts for 0.015-0.15%, zinc Zn accounts for 0.05-0.20%, stannum Sn accounts for 0.005-0.050%, magnesium Mg accounts for 0.008-0.05%, the sum of impurities does not exceed 0.1%, the sum of alloy elements and impurities is 0.15% or below, and the weight sum of the above components is 100%; then, the followingsteps of smelting, casting, saw cutting, hot rolling, face milling, cold rolling, edge cutting, annealing, rolling of finished products, cleaning, shearing of finished products and package and warehousing are carried out. The problem of high temperature softening and other aspects of an original TFe2.5 and other frame material copper strips is solved, the high-end frame material has the obvious advantages of high strength, excellent electrical conductivity, good subsequent processing performance and the like compared with frame materials prepared by adopting an original process, the chemical composition of the material is stable, and the surface is clean, smooth and free of oxidation and discoloration.

Description

technical field [0001] The invention belongs to the field of nonferrous metal smelting and processing, and in particular relates to a preparation process of copper strips for high-end frame materials. Background technique [0002] With the rapid development of the electronics industry, my country's demand for high-power plastic-encapsulated transistors and frame materials for integrated circuits is increasing. With the gradual increase in the market's requirements for copper strips for easy-to-process frames, such as IC lead frame materials and LED will be processed at high temperature, and the original frame material copper strip such as TFe2.5 cannot meet its processing requirements at high temperature, and changes in electrical conductivity and high temperature softening hardness. If it exceeds the scope of the common copper alloy national standard, the existing production process is difficult to meet the use requirements, so it becomes a new problem to produce a high-end ...

AI Technical Summary

Problems solved by technology

[0002] With the rapid development of the electronics industry, my country's demand for high-power plastic-encapsulated transistors and frame materials for integrated circuits is increasing. With the gradual increase in the market's requirements for copper strips for easy-to-process frames, such as IC lead frame materials and LED will be processed at high temperature, and the original frame material copper strip such as TFe2.5 cannot meet its processing requirements at high temperature, and changes in conductivity and high temperature softening hardness

If it exceeds the scope of the common copper alloy national standard, the existing production process is difficult to meet the use requirements, so it becomes a new problem to produce a high-end frame material copper strip that meets the use requirements and has a certain anti-softening temperature