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Preparation method of ceramic device

A device and ceramic technology, which is applied in the field of ceramic device preparation, can solve the problems of long sintering time, high sintering temperature, fine crystallization of materials and adverse effects on strength, etc.

Inactive Publication Date: 2017-11-24
GOERTEK INC
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The problem of the back cover of the mobile phone prepared by atmospheric pressure sintering is: under the atmospheric pressure sintering process, only relying on the driving force of sintering, the pores cannot be completely eliminated
[0007] In addition, the sintering temperature of atmospheric pressure sintering is relatively high, and the sintering time is relatively long, which leads to abnormal growth of grains, which adversely affects the grain refinement and strength of materials.
[0008] In addition, optimizing the sintering curve is not enough to improve the density of ceramic materials and reduce porosity, and it is still easy to cause low product yield in subsequent processing and grinding and polishing processes

Method used

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  • Preparation method of ceramic device
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Embodiment Construction

[0034] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

[0035] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses.

[0036] Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered part of the description.

[0037] In all examples shown and discussed herein, any specific values ​​should be construed as exemplary only, and not as limitations. Therefore, other instances of the exemplary embodiment may have dif...

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Abstract

The invention discloses a preparation method of a ceramic device, which comprises the steps of S1, adding a binding agent to a powder raw material and performing internal mixing and granulation to form a granule, S2, performing molding on the granule obtained in Step S1 to form a body, S3, performing degreasing treatment on the body obtained in Step S2, and S4, performing hot press sintering on the body obtained in Step S3 to form the ceramic device, wherein the degreasing treatment comprises the steps of placing the body in a solvent, performing solvent degreasing, and then performing hot degreasing on the body subjected to the solvent degreasing.

Description

technical field [0001] The invention relates to the technical field of ceramic preparation, in particular to a preparation method of a ceramic device. Background technique [0002] The material requirements for the back cover of the mobile phone include comprehensive requirements for drop resistance, heat dissipation, weight, and aesthetics. This requires the mobile phone back cover material to have the characteristics of high strength, good heat resistance and wear resistance, good electromagnetic shielding performance, stable size, and good appearance. [0003] Mobile phone back cover materials have gone through the application process from engineering plastics to metals. The disadvantages of these materials are low hardness, easy to wear, easy to age, easy to deform, easy to scratch, and not heat-resistant. Recently, ceramic materials have attracted much attention as the back cover of mobile phones. They are favored by consumers because of their excellent properties such...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/48C04B35/634C04B35/638B28B11/08B28B3/00B28B1/26
CPCB28B1/262B28B3/00B28B11/0845C04B35/48C04B35/63496C04B35/638C04B2235/3225C04B2235/661
Inventor 齐会龙俞胜平张法亮高洪伟
Owner GOERTEK INC
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