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Nickel-silver corrosive liquid for semiconductor chip

A technology for semiconductors and corrosive liquids, applied in the direction of surface etching compositions, chemical instruments and methods, etc., can solve the problems of difficult cleaning of products, micro-short circuits, and difficult cleaning, etc., and achieve long service life, high wettability, good effect

Inactive Publication Date: 2017-10-24
JIANGYIN RUNMA ELECTRONICS MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is to provide a nickel-silver corrosion solution for semiconductor chips in view of the above-mentioned prior art, which can efficiently remove nickel and silver metals in the chip, and simultaneously disperse and complex the product to make it It is easy to clean in the follow-up process, and it solves the problem that the products after general liquid corrosion are not easy to clean, which leads to the risk of poor process such as micro-short circuit and electric leakage in the line, and it is not easy to clean and requires a lot of water to clean.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Semiconductor chip nickel-silver corrosion solution composition and weight percent are respectively:

[0023] Acetic acid 65%,

[0024] Nitric acid 35%,

[0025] Surfactant 5%,

[0026] Dispersant 1%,

[0027] Complexing agent 1%,

[0028] The balance is pure water.

[0029] Wherein, the mass percentage of nickel-silver corrosion solution is 90% of acetic acid, and the mass percentage concentration of nitric acid is 60%. Among them, fatty acid methyl ester ethoxylate (FMEE) is selected as a nonionic surfactant, and a mixture of sodium alkylsulfonate and sodium alkylarylsulfonate in a mass ratio of 2:1 is used as an anionic surfactant . The dispersant is stearylamide and higher alcohol. The complexing agent is selected from sodium tripolyphosphate, sodium hexametaphosphate, diethanolamine.

Embodiment 2

[0031] Semiconductor chip nickel-silver corrosion solution composition and weight percent are respectively:

[0032] Acetic acid 40%,

[0033] Nitric acid 10%,

[0034] Surfactant 1%,

[0035] Dispersant 5%,

[0036] Complexing agent 5%,

[0037] The balance is pure water.

[0038] Wherein, the mass percentage of nickel-silver corrosion solution is 99.8% of acetic acid, and the mass percentage concentration of nitric acid is 67%. Among them, fatty acid methyl ester ethoxylate (FMEE) was selected as the nonionic surfactant, and a mixture of sodium alkylaryl sulfonates was selected as the anionic surfactant. The dispersant is glyceryl monostearate (GMS), glyceryl tristearate (HTG). The complexing agent is sodium tripolyphosphate, tartaric acid, heptose.

Embodiment 3

[0040] Semiconductor chip nickel-silver corrosion solution composition and weight percent are respectively:

[0041] Acetic acid 50%,

[0042] Nitric acid 25%,

[0043] Surfactant 3%,

[0044] Dispersant 3%,

[0045] Complexing agent 3%,

[0046] The balance is pure water.

[0047] Wherein, the mass percentage of nickel-silver corrosion solution is 95% of acetic acid, and the mass percentage concentration of nitric acid is 63%. Among them, fatty acid methyl ester ethoxylate (FMEE) was selected as the nonionic surfactant, and secondary alkyl sodium sulfate and alkylaryl sodium sulfonate were selected as the anionic surfactant at a ratio of 1:1. The dispersant is hexenyl bisstearamide, ethylene bisstearamide (EBS), tristearin glyceryl (HTG). The complexing agent is any proportion of triethanolamine and sodium alginate.

[0048] The nickel-silver corrosion solutions of the above-mentioned embodiments all have high wettability, high stability, long service life, and good co...

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Abstract

The invention relates to a nickel-silver corrosion solution for semiconductor chips, which comprises acetic acid solution, nitric acid solution, surfactant, dispersant and complexing agent, and the balance is pure water. The surfactant is a compound mixture of nonionic surfactant and anionic surfactant. The nickel-silver corrosion solution of the present application has high wettability and high stability, and will not corrode the base material of the semiconductor chip while effectively corroding nickel and silver metals. At the same time, the products are dispersed and complexed to make them easy to be cleaned in the subsequent process, which solves the technical problems that the corrosion products are difficult to clean completely and the amount of water used for cleaning is large.

Description

technical field [0001] The invention relates to a nickel-silver corrosion solution for semiconductor chips, belonging to the technical field of microelectronic chemical reagents. Background technique [0002] Ultra-clean and high-purity reagents (Ultra-clean and High-purity Reagents), known internationally as Process Chemicals, are key basic chemicals in the production of integrated circuits (IC) and very large-scale integrated circuits (VLSI). One of the materials, mainly used for chip cleaning and corrosion. The purity and cleanliness of ultra-clean and high-purity reagents have a very important impact on the yield, electrical performance and reliability of integrated circuits. [0003] After the nickel layer and silver layer are continuously plated on the semiconductor crystalline silicon material, a photoresist of a certain specification and size is coated on the silver layer for protection, and the groove coating formed between the photoresist and the photoresist needs...

Claims

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Application Information

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IPC IPC(8): C09K13/06
CPCC09K13/06
Inventor 戈烨铭
Owner JIANGYIN RUNMA ELECTRONICS MATERIAL
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