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High heat conductivity and electric conductivity organic silicon adhesive and preparation method thereof

A silicone adhesive, high electrical conductivity technology, applied in conductive adhesives, adhesives, non-polymer adhesive additives and other directions, can solve the problems of thermal conductivity filler and adhesive performance influence, thermal conductivity and other issues, to achieve a simple preparation method, pro- The effect of enhanced water performance and high content

Inactive Publication Date: 2017-09-29
DONGGUAN LIANZHOU INTPROP OPERATION MANAGEMENT CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It can be seen from the above prior art that the conductive adhesive conducts heat through the collision of free electrons of the metal and the thermal vibration of the inorganic non-metallic crystal grains, and the type, amount, particle size, geometry and surface modification of the thermally conductive filler are all suitable The thermal conductivity of the adhesive is affected, and the performance of thermally conductive fillers and adhesives may also be affected

Method used

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  • High heat conductivity and electric conductivity organic silicon adhesive and preparation method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] (1) Put boron nitride in a mixed solution of hydrogen peroxide and concentrated sulfuric acid with a volume ratio of 1:3, mechanically stir at 150r / min for 1h, take it out, wash and dry thoroughly to obtain hydroxylated boron nitride.

[0026] (2) Put the hydroxylated boron nitride in a 15 mg / mL graphene oxide solution, stir at 60°C for 5 hours until uniform, add glucose dropwise, heat and stir evenly, and obtain boron oxide with graphene attached on the surface, wherein The graphene content in the graphene-attached boron oxide was 3%.

[0027] (3) According to the mass ratio of boron oxide, aluminum oxide and silver paste with graphene attached on the surface is 1:3:0.8, dilute the silane coupling agent in ethanol solution and add it to the reaction kettle of the high-speed mixer to stir evenly, add the surface-adhered Graphene boron oxide, cylindrical α-Al2O3 with a size of 2-5μm, spherical silver ions with a particle size of 1-2μm and silver paste with flake silver p...

Embodiment 2

[0030] (1) Put boron nitride in a mixed solution of hydrogen peroxide and concentrated sulfuric acid with a volume ratio of 1:3, mechanically stir at 200r / min for 2h, take it out, wash and dry thoroughly to obtain hydroxylated boron nitride.

[0031] (2) Put hydroxylated boron nitride in a 20 mg / mL graphene oxide solution, stir at 65°C for 7 hours until uniform, add glucose dropwise, heat and stir evenly, and obtain boron oxide with graphene attached to the surface, wherein The content of graphene in the graphene-attached boron oxide was 10%.

[0032] (3) According to the mass ratio of boron oxide, aluminum oxide and silver paste with graphene attached on the surface as 1:5:1.5, dilute the silane coupling agent in ethanol solution and add it to the reaction kettle of the high-speed mixer to stir evenly, add the surface-adhered Graphene boron oxide, cylindrical α-Al2O3 with a size of 2-5μm, spherical silver ions with a particle size of 1-2μm and silver paste with flake silver p...

Embodiment 3

[0035] (1) Put boron nitride in a mixed solution of hydrogen peroxide and concentrated sulfuric acid with a volume ratio of 1:3, mechanically stir at 180r / min for 1.5h, take it out, wash and dry thoroughly to obtain hydroxylated boron nitride.

[0036] (2) Put hydroxylated boron nitride in 18 mg / mL graphene oxide solution, stir at 62°C for 6 hours until uniform, add glucose dropwise, heat and stir evenly, and obtain boron oxide with graphene attached on the surface, wherein The content of graphene in the graphene-attached boron oxide was 5%.

[0037](3) According to the mass ratio of boron oxide, aluminum oxide and silver paste with graphene attached on the surface as 1:4:1, dilute the silane coupling agent in ethanol solution and add it to the reaction kettle of the high-speed mixer to stir evenly, add the surface-adhered Graphene boron oxide, cylindrical α-Al2O3 with a size of 2-5μm, spherical silver ions with a particle size of 1-2μm and silver paste with flake silver parti...

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Abstract

The invention provides a high heat conductivity and electric conductivity organic silicon adhesive and a preparation method thereof. The high heat conductivity and electric conductivity organic silicon adhesive comprises a flaky and spherical nano silver material, cylindrical alpha-aluminum oxide and boron nitride that graphene is adhered to the surface. The preparation method specifically comprises the following steps: performing mechanical stirring on boron nitride in a mixed solution of hydrogen peroxide and concentrated sulfuric acid, taking out, sufficiently washing, and drying so as to obtain hydroxylated boron nitride; putting the hydroxylated boron nitride into a graphene oxide solution, uniformly stirring, dropping glucose, and heating while stirring so as to obtain boron oxide that graphene is adhered to the surface; diluting a coupling agent into an ethanol solution, putting into a reaction kettle of a high-speed stirring machine, stirring, putting the boron oxide that graphene is adhered to the surface, aluminum oxide and silver paste, stirring at a high speed, stirring at a low speed in vacuum, and removing ethanol so as to obtain composite heat conduction packing; and putting silica gel into the composite heat conduction packing, stirring at low temperature, putting a crosslinking agent and a catalyst, and continuously stirring at low temperature, thereby obtaining the high heat conductivity and electric conductivity organic silicon adhesive.

Description

technical field [0001] The invention belongs to the technical field of organic silica gel adhesive materials, and in particular relates to a highly thermally conductive and highly conductive organic silica gel adhesive and a preparation method thereof. Background technique [0002] Adhesives can prevent the intrusion of moisture, dust and chemical substances to electronic components, and can improve the resistance of electronic components to external shocks and vibrations. Therefore, adhesives have been widely used in the packaging, insulation potting and other fields of electronic components. , Electronic components are developing towards miniaturization and light weight, and they will accumulate a lot of heat during operation, because if the heat cannot be dissipated in time, it is easy to form local overheating, which will reduce the reliability and working life of the system. Therefore, the development of thermally and electrically conductive adhesives with high thermal ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/04C09J9/02C09J11/04
Inventor 陈东进
Owner DONGGUAN LIANZHOU INTPROP OPERATION MANAGEMENT CO LTD
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