Temperature equalization plate and foam metal compounded radiator

Abstract

The invention relates to a temperature equalization plate and foam metal compounded radiator. An aluminum bottom plate, a copper column heat pipe, temperature equalization plates and foam metal are included. Integration of the aluminum bottom plate is achieved through the forging process, surface nickel plating is conducted, and welding is easy; and a through hole is formed in the aluminum bottom plate, the copper column heat pipe is embedded, and the embedment manner is welding or riveting. The temperature equalization plates are copper temperature equalization plates or aluminum temperature equalization plates. The aluminum bottom plate and the temperature equalization plates are welded into a whole. The temperature equalization plates are arrayed in radiating square column cracks in the upper surface of the aluminum bottom plate in an even distribution manner. The width of each radiating square column crack is the same as the thickness of each temperature equalization plate. Radiating square columns and the temperature equalization plates are in tight fit or are welded to be integrated. The foam metal is foam copper or foam aluminum, and the foam metal and the temperature equalization plates are attached through a welding process.

Description

technical field [0001] The invention relates to a vapor chamber composite foam metal radiator. Background technique [0002] Traditional high-power lighting mostly uses high-pressure sodium lamps, but with the development of technology, LED lights are gradually replacing traditional lighting methods and are widely used in the lighting field due to their advantages such as high luminous efficiency, low energy consumption, and high safety. Due to the high power of the LED, its life depends on the junction temperature, and the control of the junction temperature directly affects the life of the LED. At present, only about 30% of the LED lamp is converted into light energy, and the rest is converted into heat energy, especially for high-power COB integrated light sources. The heat dissipation requirements are more stringent. If the heat dissipation is not good, it will directly lead to light decay and even damage to the lamp bead chip. [0003] The existing heat dissipation t...

AI Technical Summary

Problems solved by technology

Due to the high power of the LED, its life depends on the junction temperature, and the control of the junction temperature directly affects the life of the LED. At present, only about 30% of the LED lamp is converted into light energy, and the rest is converted into heat energy, especially for high-power COB integrated light sources. The heat dissipation requirements are more stringent. If the heat dissipation is not good, it will directly lead to light decay and even damage to the lamp bead chip

[0003] The existing heat dissipation technology generally uses aluminum profiles or fins to dissipate heat. This method obviously has technical defects, especially when it is used in high-power LEDs. It leads to light decay and shortens the life. It increases the surface area of ​​aluminum profiles or fins for good heat dissipation, increases the weight of the lamp itself, and also increases the cost. It is too heavy and not easy to install

Images