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Poly(imide-amide) copolymer, article containing poly(imide-amide) copolymer, and electronic device including same

A technology of imide and copolymer, applied in the field of poly(imide-amide) copolymer, product containing it, its preparation and electronic device including the product, can solve problems such as adhesion limitation

Active Publication Date: 2017-07-18
SAMSUNG ELECTRONICS CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, attempts to improve reliability have been made by improving the adhesive properties of adhesives, but since various substrate (base) materials have their own different surface characteristics, there has been difficulty in developing adhesives to achieve excellent adhesion to substrate materials. limit

Method used

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  • Poly(imide-amide) copolymer, article containing poly(imide-amide) copolymer, and electronic device including same
  • Poly(imide-amide) copolymer, article containing poly(imide-amide) copolymer, and electronic device including same
  • Poly(imide-amide) copolymer, article containing poly(imide-amide) copolymer, and electronic device including same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0198] Synthesis Example: Preparation of Oligomers Containing Amide Groups

[0199] In a round bottom flask, 0.312 moles (100 g) of 2,2'-bis(trifluoromethyl)benzidine (TFDB) and 0.8744 moles (69.16 g) of pyridine were dissolved in 1942.38 g of N,N- Dimethylacetamide (DMAc), and a further 100 g of DMAC was added to the flask to dissolve the remaining TFDB. 0.2186 mol (44.38 g) of TPCl was divided into 10 portions and added separately in 10 portions at room temperature to mix with the TFDB solution, and then the mixture was vigorously stirred and reacted for 2 hours.

[0200] The resulting solution was stirred under a nitrogen atmosphere for 2 hours, then added to 14.2 L of water containing 710 g of NaCl. Then, the mixture was stirred for 10 minutes. Subsequently, the solid generated therein was filtered, resuspended with 10 L of deionized water, and then filtered again, and the process was repeated twice. The water remaining in the final filter cake was then removed as much ...

Embodiment 1

[0208] Example 1: Fabrication of Poly(imide-amide) Copolymer Films Including 0.5 Mole % Bis-APAF

[0209] By using 99.5 mol% of the compound represented by Chemical Formula 10 according to the synthesis example and 0.5 mol% of bis-APAF ((2,2'-bis(3-amino-4-hydroxybenzene base)-hexafluoropropane) as the diamine moiety to make poly(imide-amide) copolymers including 0.5 mole % bis-APAF and films formed therefrom.

[0210] Specifically, 120 g of N,N-dimethylacetamide (DMAc) was placed in a reactor under a nitrogen atmosphere and 0.0147 moles (20.25 g) of the compound represented by Chemical Formula 10 prepared in Synthesis Example containing An oligomer of an amide group was added thereto and dissolved therein at 30°C. Subsequently, 0.000075 mol (0.0270 g) of bis-APAF was added to the solution and completely dissolved therein. Then, 0.0074 moles (2.1684g) of 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA) and 0.0074 moles (3.2741g) of 4,4'-hexafluoroisopropylidene Phthalic...

Embodiment 2-5

[0213] Examples 2-5: Fabrication of Poly(imide-amide) Copolymer Membranes Including Bis-APAF

[0214] Each of the poly(imide-amide) copolymer films according to Examples 2-5 was manufactured by using the same materials and methods as in Example 1, except as follows: Denotes the compound and bis-APAF as the diamine moiety, and here, the amount of bis-APAF is 1.0 mol%, 2.0 mol%, 3.0 mol%, and 7.0 mol%, respectively, based on the oligomeric The total amount of substance and bis-APAF.

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Abstract

A poly(imide-amide) copolymer includes: an imide structural unit which is a reaction product of a first diamine and a dianhydride, and an amide structural unit which is a reaction product of a second diamine and a diacyl halide, wherein each of the first diamine and the second diamine includes 2,2'-bis-trifluoromethyl-4,4'-biphenyldiamine, and at least one of the first diamine and the second diamine further includes a compound represented by Chemical Formula 1, wherein the dianhydride includes 3,3',4,4-biphenyltetracarboxylic dianhydride and 4,4'-hexafluoroisopropylidene diphthalic anhydride, wherein the diacyl halide includes terephthaloyl chloride (TPCI), and wherein an amount of the compound represented by Chemical Formula 1 is less than or equal to about 10 mole percent based on the total amount of the first diamine and the second diamine: NH2-A-NH2 Chemical Formula 1, wherein in Chemical Formula 1, A is the same as described in the detailed description.

Description

[0001] related application [0002] This application claims the benefit of Korean Patent Application Nos. 10-2015-0143063 and 10-2016-0127429 filed in the Korean Intellectual Property Office on October 13, 2015 and October 4, 2016, respectively, the entire contents of which Interest is incorporated herein by reference. technical field [0003] Disclosed are poly(imide-amide) copolymers, methods of making poly(imide-amide) copolymers, articles comprising poly(imide-amide) copolymers, and electronic devices comprising said articles ( device). Background technique [0004] For the construction of flexible devices, there is a need for stacks (stacks) of various multilayer films. For example, a transparent flexible display device requires a multilayer stack of the following: outermost hard coat layer, transparent window substrate (base) material, adhesive, polarizing film, adhesive, light emission driver, etc. The multiple layers are currently stacked and bonded by using an ad...

Claims

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Application Information

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IPC IPC(8): C08G73/10C08G69/32C08J5/18C08L79/08C08L77/10
CPCC08G69/32C08G73/1039C08G73/1042C08G73/1064C08G73/1067C08J5/18C08J2377/10C08J2379/08C08G73/14C08G73/1078C08G73/1003C08J5/00
Inventor 池尚洙全贤贞崔诚原孙炳熙朱京植
Owner SAMSUNG ELECTRONICS CO LTD
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