Phosphorus-containing nitrogen-containing halogen-free flame-retardation epoxy resin glue, prepreg and high temperature-resistant halogen-free flame-retardation insulation structural member

A technology of epoxy resin glue and halogen epoxy resin, applied in insulators, insulators, electrical components, etc., can solve problems such as lack of mechanical properties, achieve excellent electrical properties, improve flame retardant properties, and improve reliability.

Inactive Publication Date: 2017-07-04
SUZHOU JUFENG ELECTRICAL INSULATION SYST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] For example, Chinese patent CN1238422C discloses a phosphorus-containing nitrogen-containing halogen-free flame-retardant epoxy resin composition and prepregs and laminates containing the composition. The composition includes a non-halogenated epoxy resin, a The reaction product and the curing agent and curing accelerator containing nitrogen in the molecule, the reaction product is composed of a phosphorus-containing compound containing at least one P-H or P-C bond in the molecule and at least one selected from carbon-carbon double bonds, carbon-carbon double bonds, Epoxy bond, alcoholic hydroxyl group, phenolic hydroxyl group, carbonyl group, amino group, cyanate group and isocyanate group functional group compound reaction, the composition contains phosphorus and nitrogen, and does not add any halogen-containing or inorganic flame retardants, The composition has good flame retardancy and electrical properties, but its mechanical properties are lacking

Method used

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  • Phosphorus-containing nitrogen-containing halogen-free flame-retardation epoxy resin glue, prepreg and high temperature-resistant halogen-free flame-retardation insulation structural member
  • Phosphorus-containing nitrogen-containing halogen-free flame-retardation epoxy resin glue, prepreg and high temperature-resistant halogen-free flame-retardation insulation structural member
  • Phosphorus-containing nitrogen-containing halogen-free flame-retardation epoxy resin glue, prepreg and high temperature-resistant halogen-free flame-retardation insulation structural member

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] This example provides a phosphorus-containing nitrogen-containing halogen-free flame-retardant epoxy resin glue, and the raw material formula is shown in Table 1. The phosphorus-containing nitrogen-containing halogen-free flame-retardant epoxy resin glue is prepared by the following steps: Accurately weigh 40 mass One part of phosphorus-containing halogen-free epoxy resin is placed in a reaction kettle equipped with a motor-mechanical stirrer, a thermocouple, and a reflux condenser. Turn on the stirrer, turn on the thermocouple to heat the epoxy resin at 100°C, and then add 20 Parts by mass of triallyl isocyanurate (TAIC) and 12 parts by mass of 4,4'-bismaleimide diphenylmethane (BMI) were stirred for 1 hour until uniform dispersion. Then slowly add 7.2 parts by mass of 950 curing agent and 1 part by mass of 2PZ, and continue stirring for 2 hours to fully disperse the curing agent and curing accelerator. After cooling down to 40° C., 0.8 parts by mass of No. 50 green pi...

Embodiment 2

[0046] This example provides a phosphorus-containing nitrogen-containing halogen-free flame-retardant epoxy resin glue, and the raw material formula is shown in Table 1. The phosphorus-containing nitrogen-containing halogen-free flame-retardant epoxy resin glue is prepared by the following steps: Accurately weigh 50 mass One part of phosphorus-containing halogen-free epoxy resin is placed in a reaction kettle equipped with a motor-mechanical stirrer, a thermocouple, and a reflux condenser. Turn on the stirrer, turn on the thermocouple to heat the epoxy resin at 90°C, and then add 15 Parts by mass of TAIC and 7 parts by mass of BMI were stirred for 2 hours until uniform dispersion. Then slowly add 7.2 parts by mass of 950 curing agent and 1 part by mass of 2PZ, and continue stirring for 1 hour to fully disperse the curing agent and curing accelerator. After cooling down to 50° C., 0.8 parts by mass of No. 50 green pigment and 19 parts by mass of acetone were added, and then ful...

Embodiment 3

[0049] This example provides a phosphorus-containing nitrogen-containing halogen-free flame-retardant epoxy resin glue, and the raw material formula is shown in Table 1. The phosphorus-containing nitrogen-containing halogen-free flame-retardant epoxy resin glue is prepared by the following steps: Accurately weigh 60 mass One part of phosphorus-containing halogen-free epoxy resin is placed in a reaction kettle equipped with a motor mechanical stirrer, a thermocouple, and a reflux condenser. Turn on the stirrer, turn on the thermocouple to heat the epoxy resin at 90°C, and then add 6 Parts by mass of TAIC and 6 parts by mass of BMI were continuously stirred for 1.5 h until the dispersion was uniform. Then slowly add 7.2 parts by mass of 950 curing agent and 1 part by mass of 2PZ, and continue stirring for 1.5 hours to fully disperse the curing agent and curing accelerator. After cooling down to 45° C., 0.8 parts by mass of No. 50 green pigment and 19 parts by mass of acetone wer...

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Abstract

The invention relates to a phosphorus-containing nitrogen-containing halogen-free flame-retardation epoxy resin glue, a prepreg and a high temperature-resistant halogen-free flame-retardation insulation structural member. The epoxy resin glue comprises the following raw materials in parts by weight: 40-60 parts of phosphorus-containing halogen-free epoxy resin; 4.5-20 parts of triallyl isocyanurate, 6-22.5 parts of 4,4'-bimaleimide diphenylmethane, 5-10.8 parts of a curing agent, 0.5-1.5 parts of a curing accelerator, 0.5-1 part of a colouring agent, and 10-25 parts of a solvent. The prepreg and the insulation structural member prepared by the epoxy resin glue have high temperature resistance (H grade), the flame resistance rate can reach an UL94 V-0 grade flame-retardation standard, the halogen total content is less than 500 PPM, the prepreg and the insulation structural member have excellent electrical performance, mechanical property, bonding property and heat resistance. The insulation structural member can be used for increasing the flame-retardation performance of a H-grade laminated board, increases the usage reliability, and can satisfy requirement of market at home and abroad.

Description

technical field [0001] The invention relates to a phosphorus-containing nitrogen-containing halogen-free flame-retardant epoxy resin glue and a preparation method thereof, a prepreg and a high-temperature-resistant halogen-free flame-retardant insulating structural member prepared by using the epoxy resin glue. Background technique [0002] As the power of electronic components increases, the assembly density of the whole machine becomes higher and higher, and fire accidents of electronic devices occur frequently. In order to prevent fires, various electronic components must meet the safety and fire prevention requirements. Among the materials, glass fiber will not burn. Therefore, in order to manufacture flame-retardant insulating structural parts, flame-retardant materials must be added to the resin. The elements or compounds in Group VII have certain flame-retardant properties. Therefore, halogen-containing resins are often ideal base materials for flame-resistant insulat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K5/3492C08K5/3415C08K9/06C08K7/14H01B17/56H01B19/00
CPCC08K5/34924C08K5/3415C08K7/14C08K9/06H01B17/56H01B19/00C08L63/00
Inventor 夏宇刘维刚宁方为周成王文
Owner SUZHOU JUFENG ELECTRICAL INSULATION SYST
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