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Borosilicate fluorescent glass with high heat conductivity coefficient and preparation method thereof

A fluorescent glass and borosilicate technology, applied in the field of materials science, can solve the problems affecting the luminous efficiency and service life, light decay, and color coordinates of LED light sources, and achieve good chemical stability, mechanical strength, and thermal stability. Good, avoid the effect of easy moisture

Active Publication Date: 2017-06-06
SHANGHAI INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Aiming at the above-mentioned technical problems in the prior art, the present invention provides a borosilicate fluorescent glass material with high thermal conductivity and its preparation method. The borosilicate fluorescent glass material with high thermal conductivity and its preparation method It is necessary to solve the technical problems that the color coordinates are elegant and the light decay is caused by heat dissipation after LED packaging in the prior art, which affects the luminous efficiency and service life of the LED light source.

Method used

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  • Borosilicate fluorescent glass with high heat conductivity coefficient and preparation method thereof
  • Borosilicate fluorescent glass with high heat conductivity coefficient and preparation method thereof
  • Borosilicate fluorescent glass with high heat conductivity coefficient and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Composition is as shown in 4# in table 1, and concrete preparation process is as follows:

[0026] According to the molar percentage of the 4# glass composition in Table 1, calculate the weight of the corresponding components, weigh each raw material and mix them evenly; put the mixture into a corundum crucible and melt it in a silicon carbide rod electric furnace at 1050 ° C ~ 1100 ° C , clarified for 15 minutes after complete melting, and poured the molten glass liquid into distilled water at room temperature; after a little cooling, it was quickly moved into a drying box for drying, and after drying, it was ground into powder, d 50 Around 12 μm. The glass powder and Ce:YAG phosphor were mixed evenly according to the mass ratio of 20:1 and placed in a muffle furnace at 580°C for sintering. After 15 minutes, the sample was taken out for cutting, grinding and polishing for subsequent testing.

[0027] The test results for this glass are as follows:

[0028] Process th...

Embodiment 2

[0030] Composition is as shown in 7# in table 1, and concrete preparation process is as follows:

[0031] According to the molar percentage of the 7# glass composition in Table 1, calculate the weight of each composition, weigh each raw material and mix them evenly; put the mixture into a corundum crucible and melt it in a silicon carbide rod electric furnace at 1050°C to 1100°C , clarified for 15 minutes after complete melting, and poured the molten glass liquid into distilled water at room temperature; after a little cooling, it was quickly moved into a drying box for drying, and after drying, it was ground into powder, d 50 Around 12 μm. The glass powder and Ce:YAG phosphor were mixed evenly according to the mass ratio of 20:1 and placed in a muffle furnace at 580°C for sintering. After 15 minutes, the sample was taken out for cutting, grinding and polishing for subsequent testing.

[0032] The test results for this glass are as follows:

[0033] Process the sample into a...

Embodiment 3

[0035] Composition is as shown in 11# in table 1, and concrete preparation process is as follows:

[0036] According to the molar percentage of the 11# glass composition in Table 1, calculate the weight of each composition, weigh each raw material and mix them evenly; put the mixture into a corundum crucible and melt it in a silicon carbide rod electric furnace at 1050°C to 1100°C , clarified for 15 minutes after complete melting, and poured the molten glass liquid into distilled water at room temperature; after a little cooling, it was quickly moved into a drying box for drying, and after drying, it was ground into powder, d 50 Around 12 μm. The glass powder and Ce:YAG phosphor were mixed uniformly according to the mass ratio of 15:1 and placed in a muffle furnace at 580°C for sintering. After 15 minutes, the sample was taken out for cutting, grinding and polishing for subsequent testing.

[0037] The test results for this glass are as follows:

[0038] Process the sample i...

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Abstract

The invention discloses borosilicate fluorescent glass with high heat conductivity coefficient which is prepared from matrix glass powder and Ce: YAG fluorescent powder. The matrix glass powder is prepared from the following components: 0-15mol% of SiO2, 20-55mol% of B2O3, 10-50mol% of ZnO, 0-15mol% of TiO2, 5-20mol% of Na2O and 0-5mol% of Li2O; and the doping amount of the Ce: YAG fluorescent powder is 1-10wt% of the total weight of the matrix glass powder. The invention also provides a preparation method of the fluorescent glass. A fluorescent glass sheet, serving as a fluorescence conversion material of a white-light LED, has the advantages of high thermal conductivity and good thermal stability. Compared with the traditional encapsulation modes of silica gel and epoxy resin, the borosilicate fluorescent glass with the high heat conductivity coefficient is good in environment stability, does not have the problem of ageing, yellowing, color decaying, light efficiency lowering and the like and is particularly suitable for certain high-power LED illumination devices.

Description

technical field [0001] The invention belongs to the field of materials science and relates to an LED packaging technology, in particular to a borosilicate fluorescent glass material with high thermal conductivity and a preparation method thereof. Background technique [0002] LED light sources have significant advantages such as long life, low energy consumption, no pollution, high efficiency, and small size. They have broad application prospects in the field of lighting and display, and are in line with the development direction of future light sources. [0003] The current mainstream LED packaging form is to mix transparent organic silica gel with Ce:YAG phosphor powder, and then dispense glue on the InGaN blue light chip. Due to the existence of organic silica gel in the current packaging mode, when the light source continues to work, the heat of the chip will cause yellowing and aging of the organic matter attached to it, which will cause color coordinates to flutter and...

Claims

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Application Information

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IPC IPC(8): C03C4/12C03C3/074
CPCC03C3/074C03C4/12
Inventor 赵国营房永征金文田徐玲芝刘玉峰侯京山张娜邹军
Owner SHANGHAI INST OF TECH
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