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Printable flexible conductive paste as well as conductive line and preparation method thereof

A flexible conductive and paste technology, applied in the direction of printed circuits, printed circuit components, conductive materials dispersed in non-conductive inorganic materials, etc.

Active Publication Date: 2017-05-31
SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At the same time, the use of organic solvents in the flexible conductive silver paste will limit its use on certain substrate materials, such as organic solvents may dissolve or corrode fiber paper-based substrates

Method used

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  • Printable flexible conductive paste as well as conductive line and preparation method thereof
  • Printable flexible conductive paste as well as conductive line and preparation method thereof
  • Printable flexible conductive paste as well as conductive line and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0094] (1) Synthesis of composite conductive particles

[0095] With polystyrene microspheres with an average particle size of about 5.5 μm as the core, the surface is plated with silver by an electroless plating process to obtain silver-plated conductive particles (such as figure 1 and figure 2 shown). The preparation steps of silver-plated conductive particles are as follows: i) coarsening: 1 gram of styrene microsphere powder is added in a beaker, and 20 milliliters of concentration is added into the beaker as 98% concentrated sulfuric acid, and the beaker is placed in an ultrasonic device to ultrasonically make the polymer Styrene powder was uniformly dispersed in concentrated sulfuric acid, then the beaker was transferred to a water bath at 50°C, reacted for 4 hours under magnetic stirring, washed with deionized water, and then made into a 200mL 5mg / mL aqueous dispersion; ii) sensitive Chemicalization: Add 200mL 5mg / mL coarse polystyrene microsphere aqueous dispersion ...

Embodiment 2

[0100] (1) Synthesis of composite conductive particles

[0101] The polystyrene microsphere with an average particle diameter of about 1 μm is used as the core, and the surface is plated with silver by an electroless plating process to obtain silver-plated conductive particles.

[0102] (2) Preparation of mixed slurry of silver-plated conductive particles and PDMS flexible polymer

[0103] Add silver-plated polystyrene conductive particles to the mixture of PDMS prepolymer and its curing agent (the mass ratio of conductive particles to PDMS is 7:3), rotate and mix at a high speed at room temperature, and then vacuumize and debubble for 30 minutes to obtain Flexible conductive paste. The above slurry was printed on substrates of different materials such as glass, polyethylene terephthalate (PET) film, A4 paper, etc. by metal mask scraping technology, and heated at 80°C for 4h to print The slurry is cured and formed to form a flexible conductive circuit. After testing and cal...

Embodiment 3

[0105] (1) Synthesis of composite conductive particles

[0106] The polystyrene microsphere with an average particle diameter of about 1 μm is used as the core, and the surface is plated with silver by an electroless plating process to obtain silver-plated conductive particles.

[0107] (2) Preparation of mixed slurry of silver-plated conductive particles and PDMS flexible polymer

[0108] Silver-plated polystyrene conductive particles were added to the mixture of PDMS prepolymer and its curing agent (the mass ratio of conductive particles to PDMS was 1:1), mechanically stirred and mixed evenly at room temperature, and then vacuumed to remove air bubbles for 30 minutes to obtain Flexible conductive paste. Print the above paste on substrates of different materials such as glass, stainless steel sheet, plastic, rubber, A4 paper, etc. by screen printing technology, and leave it at room temperature for 24 hours to cure the printing paste to form a flexible conductive circuit. . ...

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Abstract

The invention discloses printable flexible conductive paste as well as a conductive line and a preparation method thereof. Particularly, the printable flexible conductive paste is prepared from composite conductive particles and polysiloxane, wherein the mass percent of the composite conductive particles is 40 to 85 percent; the composite conductive particles are particles of which the nonmetallic kernel surface is plated with a metal surface layer and the diameter is not greater than 20mu m. Silver-plated conductive particles are used to replace traditional pure metal conductive particles or carbon series conductive filler, have the characteristics of high electrical conductivity, low density and low cost, are not easy to settle in a polysiloxane flexible polymer and can be used for preparing flexible conductive paste with high conductivity; in addition, simple production of the flexible conductive line can be realized by traditional printing modes such as silk-screen printing. The printable flexible conductive paste disclosed by the invention has the advantages of low cost, simple structure, simplicity and feasibility in production and suitability for the emerging fields such as flexible printed circuits, flexible display screens, flexible wearable electronics, electronic skin and the like.

Description

technical field [0001] The invention relates to a printable flexible conductive paste, a conductive circuit and a preparation method thereof. Background technique [0002] In addition to the conductive function of traditional conductive lines, flexible conductive lines also have mechanical flexibility, which can adapt to various mechanical deformations such as stretching, bending, winding, folding, and twisting. They are used in flexible printed circuits, flexible displays, flexible electronic skins, Emerging fields such as wearable electronics have important application prospects. Printing technology is one of the important methods to realize large-area, fast and efficient production of circuit patterns. The conductive paste and its conductive circuit, which integrates conductivity, flexibility and printability, are the frontier direction in the field of modern electronic material research and have attracted widespread attention. [0003] The main components of the conduc...

Claims

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Application Information

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IPC IPC(8): H01B1/22H01B1/02H01B5/14H01B13/00H05K1/09
CPCH01B1/02H01B1/22H01B5/14H01B13/00H05K1/092
Inventor 胡友根孙蓉赵涛朱朋莉张愿朱玉
Owner SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
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