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Heat-conducting and wave-absorbing rubber material and preparation method thereof

A rubber material and rubber technology, applied in the field of heat-conducting and wave-absorbing rubber materials and their preparation, can solve the problems of complex electromagnetic environment, electromagnetic interference, information leakage, etc., and achieve the effects of radiation resistance and high air permeability

Inactive Publication Date: 2017-05-31
DALIAN DONGSHIN MICROWAVE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the miniaturization and high integration of electronic components make the electromagnetic environment we live in more and more complex, causing electromagnetic interference, electromagnetic pollution and information leakage and other hazards.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] A heat-conducting and wave-absorbing rubber material, comprising the following substances in parts by weight:

[0045] Methyl vinyl silicone rubber: 100 parts;

[0046] Aluminum oxide: 50 parts;

[0047] Iron carbonyl: 100 parts;

[0048] Zinc stearate: 1.5 parts;

[0049] 2,5-Dimethyl-2,5-bis(tert-butylperoxy)hexane: 1 part.

[0050] A method for preparing the above-mentioned heat-conducting wave-absorbing rubber material has the following steps:

[0051] S1, kneading the methyl vinyl silicone rubber, the aluminum oxide, the carbonyl iron and the zinc stearate according to the parts by weight;

[0052] S2. After storing the mixture obtained in step S1 for 12 hours, add the 2,5-dimethyl-2,5-bis(tert-butylperoxy)hexane according to the weight part, and mix to obtain rubber compound;

[0053] S3, calendering and cutting the mixed rubber into a film with a certain size;

[0054] S4, performing vulcanization and compression molding on the film, the vulcanization temp...

Embodiment 2

[0057] A heat-conducting and wave-absorbing rubber material, comprising the following substances in parts by weight:

[0058] Methyl vinyl silicone rubber: 100 parts;

[0059] Aluminum oxide: 100 parts;

[0060] Iron carbonyl: 50 parts;

[0061] Zinc stearate: 2 parts;

[0062] 2,5-Dimethyl-2,5-bis(tert-butylperoxy)hexane: 1 part.

[0063] A method for preparing the above-mentioned heat-conducting wave-absorbing rubber material has the following steps:

[0064] S1, kneading the methyl vinyl silicone rubber, the aluminum oxide, the carbonyl iron and the zinc stearate according to the parts by weight;

[0065] S2. After storing the mixture obtained in step S1 for 12 hours, add the 2,5-dimethyl-2,5-bis(tert-butylperoxy)hexane according to the weight part, and mix to obtain rubber compound;

[0066] S3, calendering and cutting the mixed rubber into a film with a certain size;

[0067] S4, performing vulcanization and compression molding on the film, the vulcanization temper...

Embodiment 3

[0070] A heat-conducting and wave-absorbing rubber material, comprising the following substances in parts by weight:

[0071] Methyl vinyl silicone rubber: 100 parts;

[0072] Aluminum oxide: 100 parts;

[0073] Iron carbonyl: 100 parts;

[0074] Zinc stearate: 1 part;

[0075] 2,5-Dimethyl-2,5-bis(tert-butylperoxy)hexane: 1 part.

[0076] A method for preparing the above-mentioned heat-conducting wave-absorbing rubber material has the following steps:

[0077] S1, kneading the methyl vinyl silicone rubber, the aluminum oxide, the carbonyl iron and the zinc stearate according to the parts by weight;

[0078] S2. After storing the mixture obtained in step S1 for 12 hours, add the 2,5-dimethyl-2,5-bis(tert-butylperoxy)hexane according to the weight part, and mix to obtain rubber compound;

[0079] S3, calendering and cutting the mixed rubber into a film with a certain size;

[0080] S4, performing vulcanization and compression molding on the film, the vulcanization temperat...

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Abstract

The invention discloses a heat-conducting and wave-absorbing rubber material and a preparation method thereof. The heat-conducting and wave-absorbing rubber material is prepared from the following substances in parts by weight: 100 parts of a rubber matrix, 50-600 parts of heat-conducting powder, 50-400 parts of wave-absorbing powder, 0-2 parts of a release agent and 0.5-2 parts of a cross-linking agent. The heat-conducting and wave-absorbing rubber material has the properties of high temperature resistance, low temperature resistance, high voltage resistance, ozone aging resistance, radiation resistance, weather resistance, physiologically inert property, high permeability and solvent resistance, and especially has outstanding high temperature resistance, so that the possibility is provided for preparation of the heat-conducting and wave-absorbing material; the heat-conducting and wave-absorbing rubber material can be directly applied between a heat dissipation room and a metal housing, and heat energy can be effectively exported; and meanwhile, the heat-conducting and wave-absorbing rubber material has electromagnetic shielding and electromagnetic noise wave absorbing properties, so that a good solving scheme is provided for electronic communication products in heat conduction and electromagnetic shielding.

Description

technical field [0001] The invention relates to a wave-absorbing rubber material, in particular to a heat-conducting wave-absorbing rubber material and a preparation method thereof. Background technique [0002] With the rapid development of information technology and the continuous improvement of electromagnetic theory, electromagnetic waves, as the carrier of information transmission, enrich all aspects of our production, life and society with its high speed and intelligence. However, the miniaturization and high integration of electronic components make the electromagnetic environment we live in more and more complex, causing electromagnetic interference, electromagnetic pollution and information leakage and other hazards. At the same time, heat dissipation is extremely important to electronic products. Statistics show that the reliability of electronic components decreases by 10% for every 2°C increase in temperature; the life at 50°C is only 1 / 6 of that at 25°C. Theref...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08K13/02C08K3/22C08K3/08C08K5/098C08K5/14C09K5/14
CPCC08K13/02C08K3/08C08K3/22C08K5/098C08K5/14C08K2003/0856C08K2003/2227C09K5/14C08L83/04
Inventor 来科
Owner DALIAN DONGSHIN MICROWAVE TECH
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