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Preparation method of halogen-free CEM-1 copper-clad plate with high peeling strength

A CEM-1, high peeling technology, applied in chemical instruments and methods, paper/cardboard layered products, lamination, etc., can solve the problems of low peel strength, poor processing performance, high production cost, and achieve high peel strength, Satisfy heat resistance and improve sheet toughness

Active Publication Date: 2017-05-31
SHANDONG JINBAO ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the above process has problems such as high production cost, low CTI, low peel strength, and poor processability.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] A preparation method of high peel strength, halogen-free CEM-1 copper clad laminate, the steps are as follows:

[0032] (1) Preparation of resin emulsion for glass cloth: 20 parts of phosphorus-containing epoxy resin, 40 parts of bisphenol A epoxy resin, 2.35 parts of dicyandiamide, 0.12 part of imidazole, 15 parts of aluminum hydroxide, 15 parts of melamine polyphosphoric acid Salt, 0.12 parts of silane coupling agent and 10 parts of acetone are mixed and stirred evenly;

[0033] (2) Preparation of resin emulsion for bleached wood pulp paper: 12 parts of phosphorus-containing epoxy resins, 20 parts of bisphenol A epoxy resins, 18 parts of phosphorus-containing novolak resins, 7 parts of phenol-type novolac epoxy resins, 16 parts of Tung oil modified phenolic resin, 0.2 part of imidazole, 12 parts of triphenyl phosphate, 12 parts of melamine polyphosphate and 15 parts of acetone are mixed and stirred evenly;

[0034] (3) Coat the resin emulsion prepared in step (1) on ...

Embodiment 2

[0039] A preparation method of high peel strength, halogen-free CEM-1 copper clad laminate, the steps are as follows:

[0040] (1) Preparation of resin emulsion for glass cloth: 25 parts of phosphorus-containing epoxy resin, 36 parts of bisphenol A type epoxy resin, 2.5 parts of diaminodiphenyl alkane and diaminodiphenyl alum, 0.2 part of imidazole, 16 parts of hydrogen Aluminum oxide, 13 parts of melamine cyanurate, 0.1 part of silane coupling agent and 10 parts of ethanol are mixed and stirred evenly;

[0041] (2) prepare resin emulsion for bleached wood pulp paper: with 16 parts of phosphorus-containing epoxy resins, 18 parts of bisphenol A type epoxy resins, 16 parts of phosphorus-containing novolak resins, 7 parts of o-cresol type novolac epoxy resins, 18 parts of tung oil modified phenolic resin, 0.18 part of imidazole, 13 parts of N-methylol propionamide methyl phosphonate, 13 parts of melamine cyanurate and 16 parts of ethanol are mixed and stirred evenly;

[0042] (3...

Embodiment 3

[0047] A preparation method of high peel strength, halogen-free CEM-1 copper clad laminate, the steps are as follows:

[0048] (1) Preparation of resin emulsion for glass cloth: 30 parts of phosphorus-containing epoxy resin, 30 parts of bisphenol A epoxy resin, 2.0 parts of diaminodiphenylane, 0.3 part of imidazole, 18 parts of aluminum hydroxide, 12 parts of melamine Polyphosphate and melamine cyanurate, 0.15 parts of silane coupling agent and 12 parts of cyclohexanone are mixed and stirred evenly;

[0049] (2) Preparation of resin emulsion for bleached wood pulp paper: 10 parts of phosphorus-containing epoxy resin, 16 parts of bisphenol A type epoxy resin, 17 parts of phosphorus-containing novolak resin, 8 parts of biphenyl type novolac epoxy resin, 16 parts Part of tung oil modified phenolic resin, 0.1 part of imidazole, 15 parts of ODOPB, 14 parts of melamine polyphosphate and melamine cyanurate, 20 parts of cyclohexanone are mixed and stirred evenly;

[0050] (3) Coat th...

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Abstract

The invention belongs to the technical field of copper-clad plate production, and especially relates to a preparation method of a halogen-free CEM-1 copper-clad plate with a high peeling strength. Phosphor containing epoxy resin and bisphenol A type epoxy resin are taken as the main resin; phosphor containing linear phenolic resin is taken as the curing agent, polyfunctional epoxy resin is used to enhance the heatproof performance; a certain ratio of aluminum hydroxide is added to increase the electric tracking resistant index of the copper-clad plate; a nitrogen and phosphor containing fire retardant is added, and through the synergistic effect between nitrogen and phosphor, the fireproof performance of the copper-clad plate is enhanced and can reach the FV0 grade. By processing the surface of used filling material and controlling the particle size, the filling material can be evenly dispersed into resin glue to obtain uniform glue dipped sheets, the toughness of sheets is improved, the obtained copper-clad plate can reach the environment protection requirements and does not contain any halogen, the contents of chlorine and bromine are low, the peeling strength is high, the characteristic of resisting tracking caused by electric leakage is excellent, and CTI>=600V.

Description

technical field [0001] The invention belongs to the technical field of copper-clad laminate production, and in particular relates to a preparation method of a high-peeling-strength, halogen-free CEM-1 copper-clad laminate. Background technique [0002] The flame retardancy of CCL is one of the important safety performances of electronic products. For a long time, printed circuit board substrates mainly use halogens for flame retardancy. However, since the 1980s, researchers in Switzerland, Germany, Japan and other countries have found that toxic gases and carcinogens will be produced during the combustion process, which has hidden dangers to the environment and human health. Therefore, it is the general trend to research and produce the use of halogen-free flame-retardant printed circuit substrates. [0003] At present, to realize the halogen-free flame retardancy of CEM-1 copper clad laminates, the general method is to use phosphorus-containing epoxy as the main resin, ad...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B29/06B32B29/02B32B17/06B32B15/20B32B15/14B32B37/06C08L63/00C08K13/04C08K7/14C08K3/22D21H19/24
CPCB32B15/14B32B15/20B32B17/061B32B17/065B32B29/002B32B29/02B32B29/06B32B37/06B32B2307/306C08L63/00C08L2201/02C08L2201/08C08L2205/025D21H19/24C08K13/04C08K7/14C08K2003/2227
Inventor 刘文江李宝东郑宝林朱义刚王天堂徐树民赵东周鸥陈晓鹏陈长浩高淑丽姜晓亮
Owner SHANDONG JINBAO ELECTRONICS
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