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Aluminum nitride powder for aluminum nitride ceramic substrate and preparation method of aluminum nitride powder

A technology of aluminum nitride ceramics and aluminum nitride, which is applied in the field of material science, can solve problems such as difficulty in mixing aluminum nitride powder and sintering aids uniformly, unsatisfactory shock resistance of the substrate, thermal conductivity and compactness, etc. Achieve the effects of inhibiting excessive growth of particles, simple and easy preparation method, and low equipment requirements

Active Publication Date: 2017-05-24
HEBEI LIFU CHEM TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide an aluminum nitride powder for aluminum nitride ceramic substrate and its preparation method, in order to solve the difficulty in mixing aluminum nitride powder and sintering aids uniformly in the sintering process of the existing aluminum nitride substrate, and the substrate Unsatisfactory shock resistance, thermal conductivity and compactness

Method used

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  • Aluminum nitride powder for aluminum nitride ceramic substrate and preparation method of aluminum nitride powder
  • Aluminum nitride powder for aluminum nitride ceramic substrate and preparation method of aluminum nitride powder
  • Aluminum nitride powder for aluminum nitride ceramic substrate and preparation method of aluminum nitride powder

Examples

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Effect test

Embodiment 1

[0029] Commercially available superfine alumina powder, carbon black and sintering aid (Y 2 o 3 3.2wt%, LuF 3 2wt%), put it into an ethanol medium ball mill tank, mill it for 10 hours, then dry it at 80°C for 4 hours, and pass it through a 200-mesh sieve to obtain a precursor mixture, then put it into an alumina ark crucible, and put it into a horizontal corundum tube furnace, sintered at 1600°C for 4h, and then put the obtained powder in an alumina crucible, and decarburized it in a box furnace at 700°C for 2h in an air atmosphere. Soak in diphosphoric acid solution for 2h, filter, dry, and sieve. Then press the obtained powder into a graphite grinding tool, set the pressure at 5MPa, lay graphite paper on the contact area between the grinding tool and graphite, coat the surface of the graphite paper with BN release agent, and sinter at 1800°C for 4 hours under a nitrogen atmosphere, and the nitrogen pressure is 9.8Mpa, after the sintering is completed, cool to room tempera...

Embodiment 2-18

[0031]The type and corresponding amount of sintering aids were changed (see Table 1 for details), and other raw materials and methods were the same as in Example 1. The relevant performance tests were carried out on the final sintered aluminum nitride blank, and the results are shown in Table 1.

[0032] Table 1:

[0033]

[0034]

[0035] It can be seen from Table 1 that the addition of an appropriate amount of the sintering aid provided by the present invention can effectively improve the performance of the aluminum nitride billet sintered by the aluminum nitride powder, and its overall performance is better than that of Comparative Example 1. The sintering aid of the present invention The alkali or carbonate compounds in the compound will be converted into the corresponding oxides at high temperature, so it can have the same effect; the present invention optimizes the composition of the trace elements required for the synthesis of aluminum nitride substrates, and the i...

Embodiment 19-28

[0038] When preparing the precursor mixture, different types and amounts of additives were added (see Table 2 for details), and other raw materials and methods were the same as in Example 1. The relevant performance tests were carried out on the final sintered aluminum nitride billets, and the results are shown in Table 2.

[0039] Table 2:

[0040]

[0041] It can be seen from Table 2 that the proper use of additives makes the performance of the prepared aluminum nitride billet better, and the covalent bond of Al and other multi-covalent bond elements form a complex combination, which reduces the aluminum nitride grains and grains. The voids between them improve the compactness of the corresponding aluminum nitride billet, thereby improving its fracture toughness. Among them, BN, Si 3 N 4 、TiO 2 The effect of using is the most prominent. In addition, the effect of using too little additive is not obvious compared with no addition, while too much addition will change th...

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Abstract

The invention provides aluminum nitride powder for an aluminum nitride ceramic substrate and a preparation method of the aluminum nitride powder. The preparation method of the aluminum nitride powder comprises the following steps: (a) preparing a precursor mixture; (b) performing high temperature synthesis; (c) performing decarburization treatment; and (d) performing surface treatment. The preparation method provided by the invention is simple, low in synthetic temperature, pollution-free, and suitable for large-scale production. The invention also provides the aluminum nitride powder prepared with the method, the prepared aluminum nitride powder is good in water resistance, microelements required in a sintering process of an aluminum nitride substrate are uniformly distributed in the powder, and a more suitable powder particle size range is obtained by adjusting the usage amount of a sintering aid, thereby improving compactness, heat conductivity and shock resistance of the substrate.

Description

technical field [0001] The invention relates to the technical field of material science, in particular to an aluminum nitride powder for an aluminum nitride ceramic substrate and a preparation method thereof. Background technique [0002] With the rapid development of modern electronic technology, the whole machine is required to develop in the direction of miniaturization, light weight, high integration and high reliability. At the same time, devices are becoming more and more complex, which will lead to an increase in the size of the substrate and an increase in the integration level, which will increase the power dissipation of the substrate. Therefore, the heat dissipation of the substrate and the selection of materials have become important issues. The thermal conductivity of aluminum nitride ceramics is 8 to 10 times higher than that of alumina ceramics, and its electrical properties such as volume resistivity, breakdown field strength, and dielectric loss are comparab...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/581C04B35/626C04B35/64
CPCC04B35/581C04B35/62605C04B35/6265C04B35/64C04B2235/3201C04B2235/3208C04B2235/3215C04B2235/3217C04B2235/3225C04B2235/3227C04B2235/3229C04B2235/3232C04B2235/3244C04B2235/3267C04B2235/3284C04B2235/3286C04B2235/386C04B2235/3873C04B2235/424C04B2235/445C04B2235/77C04B2235/786C04B2235/96C04B2235/9607
Inventor 杨志平刘少鹏张银霞赵金鑫
Owner HEBEI LIFU CHEM TECH
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