High temperature and corrosion resistant HTV conductive glue and preparation method thereof

A conductive glue, corrosion-resistant technology, applied in conductive adhesives, adhesives, polymer adhesive additives, etc., can solve problems such as endangering human health, falling off of substrates, and inability to serve for a long time, and achieves a simple and easy preparation method. , the effect of strong adhesion, excellent electrical and physical properties

Inactive Publication Date: 2017-04-26
江苏晶河电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the development of high technology, electromagnetic interference and electromagnetic compatibility problems caused by electromagnetic waves are becoming more and more serious, which not only cause interference and damage to electronic instruments and equipment, but also pollute the environment and endanger human health.
In electronic equipment, more powerful functions are continuously integrated into smaller components. Traditional tin soldering can no longer meet the functions of environmental sealing and electromagnetic sealing. In order to solve the problem of environmental sealing and electromagnetic sealing in integrated circuits, the industry Many electromagnetic shielding technologies and related shielding materials have been developed, and conductive glue is one of them.
[0003] At present, there are many high-temperature vulcanized conductive adhesives on the market, most of which can only be used in ordinary environments, but cannot be used for a long time in environments containing acid-base corrosion and high temperatures. The material falls off or micropores appear, which affects the environmental sealing and electromagnetic sealing

Method used

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  • High temperature and corrosion resistant HTV conductive glue and preparation method thereof
  • High temperature and corrosion resistant HTV conductive glue and preparation method thereof

Examples

Experimental program
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Effect test

preparation example Construction

[0047] A preparation method of high temperature and corrosion resistant HTV conductive glue, comprising the following steps:

[0048] (i) Conductive powder drying

[0049] Bake the conductive powder for 60h-80h;

[0050] (ii) The particle size of the conductive powder is extremely matched

[0051] The dried conductive powder is finely matched in particle size, and the conductive powder with large and small particle sizes are respectively taken according to the weight ratio of 10:1 for pre-mixing;

[0052] (ⅲ) Coating with conductive powder

[0053] Surface treatment of the premixed powder obtained in step (ii) by a wet method to obtain a conductive powder coated with a silane coupling agent;

[0054] (ⅳ) mixed

[0055] Mix the conductive powder coated with silane coupling agent obtained in step (iii) with liquid silicone rubber, heat-resistant additives, catalysts, and cross-linking agents for 10 minutes to 2 minutes to obtain high-temperature-resistant and corrosion-resis...

Embodiment 1

[0057] Weigh 75.50 g of pure silver conductive powder with an average particle size of 30 μm and 754.5 g of silver-coated copper conductive powder with an average particle size of 60 μm, and dry the two conductive powders separately for 60 hours, then perform preliminary mixing; use 0.001 g of commercially available silane Coupling agent A-171 uses a wet method to treat the surface of the powder after the extreme matching, so that the surface is coated with a layer of titanate coupling agent; after coating, the powder is put into the double planetary mixer, Add 100g of methyl vinyl trifluoropropyl liquid silicone rubber, 10g of soluble polyferric organosiloxane, 10g of platinum catalyst and 50g of methyl hydrogen silicone oil into the mixer and mix for 10min to obtain RTV-1 type conductive glue.

Embodiment 2

[0059] Weigh 72.72g of pure silver conductive powder with an average particle size of 30μm and 727.2g of silver-coated aluminum conductive powder with an average particle size of 60μm, and dry the two conductive powders separately for 70h, then perform preliminary mixing; use 0.0025g of commercially available silane Coupling agent A-174 uses a wet method to treat the surface of the powder after the extreme matching, so that the surface is coated with a layer of titanate coupling agent; the coated powder is put into a double planetary mixer, and simultaneously Add 125g of methylvinyltrifluoropropyl liquid silicone rubber, 20g of soluble polyferric organosiloxane, 15g of platinum catalyst and 40g of methyl hydrogen silicone oil into the mixer and mix for 20min to obtain RTV-1 type conductive glue.

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Abstract

The invention discloses a high temperature and corrosion resistant HTV conductive glue and a preparation method thereof. The conductive glue comprises liquid silicon rubber, a heat resistant additive, a silane coupling agent, a catalyst, a cross-linking agent and conductive powder. The preparation method of the conductive glue comprises the steps of (i) conductive powder drying; (ii) conductive powder grain size polar matching; (iii) conductive powder coating; and (iv) mixing. The product has high using efficiency, does not need to be mixed before use, is solidified at a high temperature, has excellent electrical and physical characteristics, has quite strong adhesive performance both on metal and nonmetal, and is aging, high temperature and corrosion resistant and suitable for mounting of all kinds of silica gel and integrated circuit parts and metal-metal adhesion and conductive sealing; and the preparation method is simple, easy, safe and reliable.

Description

technical field [0001] The invention belongs to the field of electromagnetic shielding polymer materials, and in particular relates to a high-temperature-resistant and corrosion-resistant HTV conductive glue and a preparation method thereof. Background technique [0002] With the development of high technology, electromagnetic interference and electromagnetic compatibility problems caused by electromagnetic waves are becoming more and more serious, which not only cause interference and damage to electronic instruments and equipment, but also pollute the environment and endanger human health. In electronic equipment, more powerful functions are continuously integrated into smaller components. Traditional tin soldering can no longer meet the functions of environmental sealing and electromagnetic sealing. In order to solve the problem of environmental sealing and electromagnetic sealing in integrated circuits, the industry Many electromagnetic shielding technologies and related...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/08C09J9/02C09J11/08
CPCC09J183/08C08L2201/08C08L2203/20C08L2205/02C08L2205/025C08L2205/03C09J9/02C09J11/08C08L83/04C08K13/06C08K9/10C08K2003/085C08K2003/0806C08K2003/0812
Inventor 王晶杨福河
Owner 江苏晶河电子科技有限公司
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