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High-toughness and high-thermal-conductivity high-molecular material

A polymer material, high thermal conductivity technology, applied in the direction of heat exchange materials, chemical instruments and methods, etc., can solve the problems of flammability, high filling fraction of thermal conductive fillers, loss of practical value, etc., to avoid stress cracking and reduce thermal conductivity Effect of Linear Expansion Coefficient

Inactive Publication Date: 2017-04-26
ANHUI ELECTRIC GRP SHARES
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Generally speaking, in order to obtain higher thermal conductivity, the filling fraction of thermally conductive fillers is often higher, which will lead to a significant decrease in the toughness of the composite material and lose its practical value.
On the other hand, as plastic products are more and more widely used in life, flammability has become the biggest drawback of plastic products

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] A polymer material with high toughness and high thermal conductivity, its composition by mass is as follows: 10 parts of glycidyl ester epoxy resin, 35 parts of epoxidized polydibutylene, 10 parts of polyethylene glycol, 60 parts of composite thermal conductive filler, 3 parts of flame retardant, 2.5 parts of chain extender, 1 part of toughening filler, 0.3 part of antioxidant, and 0.5 part of dispersant.

[0019] Among them, the composite thermally conductive filler is a mixture of graphene and carbon nanotubes with a mass ratio of 1:2.4.

[0020] Among them, the flame retardant is phosphorus or phosphorus-nitrogen flame retardant, and the phosphorus or phosphorus-nitrogen flame retardant is aluminum diethylphosphinate.

[0021] Wherein, glass fiber is selected as the toughening filler, and the particle size of the toughening filler is 0.8-45 μm.

[0022] Wherein, the antioxidant is a mixture of antioxidant 1010 and antioxidant 168, and the mass ratio of antioxidant 1...

Embodiment 2

[0025] A polymer material with high toughness and high thermal conductivity, its composition by mass is as follows: 11 parts of glycidyl ester epoxy resin, 36 parts of epoxidized polydibutylene, 12 parts of polyethylene glycol, 62 parts of composite thermal conductive filler, 4 parts of flame retardant, 2.8 parts of chain extender, 2 parts of toughening filler, 0.5 part of antioxidant, and 0.8 part of dispersant.

[0026] Among them, the composite thermally conductive filler is a mixture of graphene and carbon nanotubes with a mass ratio of 1:2.6.

[0027] Among them, the flame retardant is a phosphorus-based or phosphorus-nitrogen-based flame retardant, and the phosphorus-based or phosphorus-nitrogen-based flame retardant is a mixture of aluminum diethylphosphinate and melamine polyphosphate, and its mass ratio is 1:1.

[0028] Wherein, the toughening filler is selected from any combination of glass fiber and shell powder, and the particle size of the toughening filler is 2.4...

Embodiment 3

[0032] A polymer material with high toughness and high thermal conductivity, its composition by mass is as follows: 12 parts of glycidyl ester epoxy resin, 40 parts of epoxidized polydibutylene, 18 parts of polyethylene glycol, 65 parts of composite thermal conductive filler, 6 parts of flame retardant, 3 parts of chain extender, 5 parts of toughening filler, 0.8 part of antioxidant, 2.4 parts of dispersant.

[0033] Wherein, the composite thermally conductive filler is a mixture of graphene and carbon nanotubes, the mass ratio of which is 1:2.8-3.

[0034] Among them, the flame retardant is a phosphorus-based or phosphorus-nitrogen-based flame retardant, and the phosphorus-based or phosphorus-nitrogen-based flame retardant is one or more of aluminum diethylphosphinate, melamine polyphosphate, ammonium polyphosphate, and red phosphorus. Various.

[0035] Wherein, the toughening filler is selected from one of glass fiber, shell powder, copolymer of ethylene and octene or any c...

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PUM

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Abstract

The invention relates to the technical field of high-molecular materials, and in particular, relates to a high-toughness and high-thermal-conductivity high-molecular material comprising the components: 10-15 parts of glycidyl ester epoxy resin, 35-45 parts of epoxide polydibutene, 10-25 parts of polyethylene glycol, 60-75 parts of a composite thermal conductive filler, 3-8 parts of a flame retardant, 2.5-3.6 parts of a chain extender, 1-10 parts of a toughening filler, 0.3-1.3 parts of an antioxidant, and 0.5-4 part of a dispersant. The toughening filler and the chain extender have a toughening effect on the composite material, and the added toughening agent has good performance of low-temperature impact resistance, so the composite material has the advantages of high thermal conductivity and high toughness, also reduces the thermal conduction linear expansion coefficient, and avoids stress cracking of products.

Description

technical field [0001] The invention relates to the technical field of polymer materials, in particular to a polymer material with high toughness and high thermal conductivity. Background technique [0002] Polymer-based composites have been widely used due to their light weight, easy processing, wear resistance, simple preparation, and easy industrialization. However, the thermal conductivity of most polymer materials is extremely low. If a certain thermal conductivity is endowed to polymer materials, the application fields of polymer materials can be greatly expanded. If the insulation performance of the polymer composite material is guaranteed on the basis of a certain thermal conductivity, it will have great positive significance for improving the accuracy and life of electrical and microelectronic devices and solving the needs of a large number of insulation and heat dissipation applications in reality. [0003] Generally speaking, in order to obtain higher thermal con...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L47/00C08L63/00C08L71/02C08L23/08C08K13/04C08K7/24C08K3/04C08K7/14C08K3/26C09K5/14
CPCC08L47/00C08K2201/003C08K2201/011C08L2201/02C08L2205/03C08L2205/035C08L2205/06C09K5/14C08L63/00C08L71/02C08L23/0815C08K13/04C08K7/24C08K3/04C08K7/14C08K2003/265
Inventor 赵建军
Owner ANHUI ELECTRIC GRP SHARES
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