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Additive-free method used for preparing high-mechanical-property electroformed copper layers at extremely low copper sulphate concentration

A technology of copper sulfate and additives, which is applied in the direction of electroforming and electrolysis, can solve the problems of additive consumption, affecting the quality of electroforming layer, and difficulty in maintenance of electroforming liquid, so as to improve dispersion ability, reduce solution resistance and optimize structure structure effect

Inactive Publication Date: 2017-04-19
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the electroforming layer needs to be very thick, many additives will be significantly consumed during the long-term electroforming process, and the composition of the electroforming solution will change, thereby affecting the quality of the electroforming layer. The maintenance of the electroforming solution is very difficult

Method used

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  • Additive-free method used for preparing high-mechanical-property electroformed copper layers at extremely low copper sulphate concentration
  • Additive-free method used for preparing high-mechanical-property electroformed copper layers at extremely low copper sulphate concentration
  • Additive-free method used for preparing high-mechanical-property electroformed copper layers at extremely low copper sulphate concentration

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Prepare the electroforming solution with deionized water, the concentrations of copper sulfate and sulfuric acid are 20g / L and 170g / L respectively

[0020] Anode 2 is made of phosphor copper plate, and workpiece 3 is a stainless steel mandrel. Before electroforming, anode 2 and workpiece 3 are ultrasonically cleaned with alcohol, and then rinsed with deionized water to obtain clean anode 2 and workpiece 3. The anode 2 is wrapped with two layers of polyester anode bags to prevent the anode mud from seeping out and affecting the quality of the electroforming layer;

[0021] The anode 2 and the workpiece 3 are placed in the electroforming tank 4, and the workpiece 3 keeps rotating in the electroforming tank 4 to accelerate ion migration and reduce concentration polarization. The electroforming process uses DC power supply 1, and the cathode current density is 0.5A / dm 2 , to prepare an electroformed copper layer with a thickness of 0.5mm, the tensile strength of the obtain...

Embodiment 2

[0023] Prepare the electroforming solution with deionized water, the concentrations of copper sulfate and sulfuric acid are 50g / L and 170g / L respectively. Anode 2 uses a phosphor copper plate, and workpiece 3 is a stainless steel mandrel. Before electroforming, anode 2 and workpiece 3 are used Ultrasonic cleaning with alcohol, followed by rinsing with deionized water, to obtain clean anode 2 and workpiece 3 . The anode 2 is wrapped with two layers of polyester anode bags to prevent the anode mud from seeping out and affecting the quality of the electroforming layer;

[0024] The anode 2 and workpiece 3 are placed in the electroforming tank 4, and the workpiece 3 keeps rotating in the electroforming tank 8 to accelerate ion migration and reduce concentration polarization. The electroforming process uses DC power supply 1, and the cathode current density is 0.5A / dm 2 , an electroformed copper layer with a thickness of 0.5mm was prepared, the tensile strength of the obtained ele...

Embodiment 3

[0026] The electroforming solution was prepared with deionized water, and the concentrations of copper sulfate and sulfuric acid were 60g / L and 170g / L, respectively.

[0027] Anode 2 is made of phosphor copper plate, and workpiece 3 is a stainless steel mandrel. Before electroforming, anode 2 and workpiece 3 are ultrasonically cleaned with alcohol, and then rinsed with deionized water to obtain clean anode 2 and workpiece 3. The anode 2 is wrapped with two layers of polyester anode bags to prevent the anode mud from seeping out and affecting the quality of the electroforming layer;

[0028] The anode 2 and the workpiece 3 are placed in the electroforming tank 4, and the workpiece 3 keeps rotating in the electroforming tank 4 to accelerate ion migration and reduce concentration polarization. The solution temperature was 30°C. The electroforming process uses DC power supply 1, and the cathode current density is 0.5A / dm 2 , to prepare an electroformed copper layer with a thickn...

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Abstract

The invention discloses an additive-free method used for preparing high-mechanical-property electroformed copper layers at an extremely low copper sulphate concentration. According to the additive-free method, extremely low copper concentration and high acid concentration are adopted to improve cathode polarization and solution dispersion capacity without adding any additives, and obtain a copper concentration range capable of preparing electroformed copper layers with excellent comprehensive mechanical properties in an extremely low copper concentration zone; a fliud flushing clamp with a positive pole is adopted to increase negative pole limiting current density, negative pole current density is increased to improve negative pole polarization further, and obtain electroformed copper layers with fine and uniform crystalline grain structures. The highest tensile strength of the electroformed copper layers prepared via the additive-free method can be 526MPa, the elongation percentage of the electroformed copper layers is increased to be 30%, the highest elongation percentage of the electroformed copper layers can be 43%, the tensile strength of the electroformed copper layers is 216MPa, and the electroformed copper with high strength and elongation percentage is capable of increasing reliability and prolonging service life of devices greatly.

Description

technical field [0001] The invention relates to an electroforming copper layer method, more precisely, an electroforming copper layer with better comprehensive mechanical properties is prepared by using an acidic sulfate solution with no additives, and belongs to the field of electroforming processing. Background technique [0002] Electroforming technology is a precision special processing method, which has extremely high replication accuracy and repeatability, especially the surface morphology of the core mold can be accurately reproduced, and the multi-layer structure of the parts is easy to obtain. Various precision, special-shaped, complex and fine metal parts with high manufacturing or manufacturing costs. Due to its high purity, fine grain, excellent electrical conductivity, thermal conductivity and ductility, electroformed copper has been widely used in aviation, military products, instruments and meters, plastics, precision machinery, mold manufacturing, electronics...

Claims

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Application Information

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IPC IPC(8): C25D1/00
CPCC25D1/00
Inventor 朱增伟沈春健朱荻
Owner NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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