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Preparation method for electronic substrate welding assistant

A technology of welding aids and electronic substrates, which is applied in the direction of welding equipment, welding media, welding/cutting media/materials, etc., can solve the problems of electronic substrate electrical insulation performance decline, environmental pollution reduction, surface activity increase, etc., to achieve no need Cleansing, less residue, anti-oxidation effect

Inactive Publication Date: 2017-03-22
常州市鼎升环保科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem mainly solved by the present invention: Aiming at the defect that the current electronic substrate solder residue contains a large amount of halogen ions, and the electrical insulation performance of the electronic substrate is reduced and pollution is easy to occur, the present invention uses succinic acid and oxalic acid triethanolamine as the core Material, using acrylic resin as the shell material to prepare microencapsulated compound active substances, then use masson pine rosin as raw material to prepare maleopimaric acid polyethylene glycol resin, and finally combine with microencapsulated compound active substances, benzo Mix triazole etc., configure electronic substrate soldering aids, the present invention utilizes the preparation of microencapsulated compound active substances to increase the surface activity of the soldering aids and enhance the compatibility between the soldering agent and the substrate, maleic anhydride Volatile additives such as volatile additives make up for the defects of traditional solder residues that cause excessive halogen ions to reduce electrical insulation performance, reduce environmental pollution, and have broad economic prospects

Method used

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Examples

Experimental program
Comparison scheme
Effect test

example 1

[0016] First weigh 1mL succinic acid, 1mL oxalic acid, 0.2mL triethanolamine, add 20mL deionized water, stir at 300r / min and heat to 50°C, add 10mL acrylic resin A890, heat up to 90°C, continue stirring for 3h, Cool to room temperature, then filter, put the filter residue in a drying oven, dry to constant weight at 105°C, then add it to a pulverizer to pulverize, pass through a 200-mesh sieve, and obtain a microencapsulated compound active substance, which is ready for use; Take 400g of masson pine rosin, put it into a four-necked flask, raise the temperature to 180°C under a nitrogen atmosphere, add 120g of maleic anhydride, keep the temperature for 3 hours, then pour it into 1.5L of turpentine at a temperature of 50°C, at 300r / min Stir and heat until the solid is completely dissolved, stop heating and let it stand for 10 hours, then filter it with suction, place the filter cake in a vacuum drying oven, and dry it at 120°C to constant weight to obtain maleopimaric anhydride; w...

example 2

[0019] First weigh 2mL succinic acid, 2mL oxalic acid, 0.4mL triethanolamine, add 30mL deionized water, stir at 400r / min and heat to 60°C, add 12mL acrylic resin A890, heat up to 95°C, continue stirring for 4h, Cool to room temperature, then filter, put the filter residue in a drying oven, dry to constant weight at 110°C, put it into a pulverizer and grind it, pass through a 200-mesh sieve to obtain a microencapsulated compound active substance, which is ready for use; Take 450g of masson pine rosin, put it into a four-necked flask, raise the temperature to 200°C under a nitrogen atmosphere, add 136g of maleic anhydride, keep the temperature for 4 hours, then pour it into 2.1L of turpentine at a temperature of 60°C, at 400r / min Stir and heat until the solid is completely dissolved, stop heating and let it stand for 12 hours, then filter with suction, place the filter cake in a vacuum drying oven, and dry it to constant weight at 125°C to obtain maleopimaric anhydride; weigh 60g...

example 3

[0022] First weigh 1.5mL succinic acid, 1.5mL oxalic acid, 0.3mL triethanolamine, add 25mL deionized water, stir at 350r / min and heat to 55°C, add 11mL acrylic resin A890, heat up to 93°C, continue stirring 3.5h, cooled to room temperature, and then filtered, the filter residue was placed in a drying oven, dried at 110°C to constant weight, then added to a pulverizer for pulverization, and passed through a 200-mesh sieve to obtain a microencapsulated compound active substance. Standby; weigh 450g of masson pine rosin, put it into a four-necked flask, heat up to 190°C under a nitrogen atmosphere, add 128g of maleic anhydride, keep the temperature for 3.5 hours, then pour into 1.9L of turpentine at a temperature of 55°C, Stir at 350r / min and heat until the solid is completely dissolved, stop heating and let it stand for 11h, then filter with suction, place the filter cake in a vacuum drying oven, and dry at 125°C to constant weight to obtain maleopimaric anhydride; weigh 55g Add...

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Abstract

The invention discloses a preparation method for an electronic substrate welding assistant and belongs to the technical field of welding assistants. Aiming at the defects that a large number of halide ions are contained in residues of current electronic substrate welding flux, the electric insulation performance is lowered, and pollution is liable to occur, the preparation method adopts succinic acid and oxalic acid triethanolamine are adopted as core materials, acrylic resin serves as a shell material, and microencapsulation compound active substances are obtained; then rosin of masson pine rosin serves as raw materials to prepare maleopimaric acid polyethylene glycol ester; and finally, the maleopimaric acid polyethylene glycol ester is mixed with the microencapsulation compound active substances, benzotriazole and the like to prepare the electronic substrate welding assistant. According to the preparation method, the microencapsulation compound active substances are prepared, thus the surface activity of the welding assistant is increased, the compatibility between the welding assistant and a welding assistant is enhanced, maleic anhydride and other volatile assistants overcome the defects that the electric insulation performance is lowered due to the fact that too many halide ions are left in residues of traditional welding flux, so that the environment pollution degree is lowered, and wide economic prospects are achieved.

Description

technical field [0001] The invention discloses a preparation method of an electronic substrate welding auxiliary, belonging to the technical field of welding auxiliary. Background technique [0002] Flux is usually a mixture of rosin as the main component, which is an auxiliary material to ensure the smooth progress of the soldering process. Welding is the main process in electronic assembly. Flux is an auxiliary material used in welding. The main function of flux is to remove the oxides on the surface of the solder and the base material to be welded, so that the metal surface can reach the necessary cleanliness. It prevents re-oxidation of the surface during soldering, reduces the surface tension of the solder, and improves soldering performance. The quality of flux performance directly affects the quality of electronic products. [0003] In recent decades, in the soldering process of electronic products, rosin resin flux mainly composed of rosin, resin, halide-containing...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/363B23K35/40
CPCB23K35/362B23K35/40
Inventor 许斌宋豪陆娜
Owner 常州市鼎升环保科技有限公司
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