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Glue solution for copper-clad plate, composite based CEM-1 copper-clad plate, and preparation methods of glue solution and composite based CEM-1 copper-clad plate

A CEM-1, copper clad laminate technology, used in chemical instruments and methods, applications, household appliances, etc., can solve the problem of heat resistance, flatness can not meet, not suitable for reflow soldering, difficult to meet high performance copper clad laminates And other issues

Active Publication Date: 2017-02-15
抚州市龙兴电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, with the lightness, thinness, miniaturization and lead-free of civilian electronic devices, the performance requirements for composite-based copper-clad laminates are getting higher and higher. The demand for copper plates, the production of composite base copper clad laminates cannot meet the performance index requirements of electronic information products such as computers, industrial electrical power supplies, lighting facilities, etc. Lead flow soldering, etc.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0083] An embodiment of the present invention provides a method for manufacturing a composite matrix CEM-1 copper-clad laminate, including the following steps:

[0084] (1) Get the raw material of the described epoxidized soybean oil modified phenolic resin of following parts by weight: 1400 parts of epoxidized soybean oil, 565 parts of phenol, 1100 parts of bisphenol A, 8 parts of 2-methylimidazoles, 945 parts of formaldehyde , 80 parts of triethylamine, 27 parts of ammonia water, 2800 parts of methanol, 30 parts of graphene, 25 parts of graphene oxide;

[0085]Add epoxidized soybean oil, phenol, and bisphenol A to the reaction kettle in turn, stir for 10 minutes to mix, then add 2-methylimidazole, and react at 180°C for 5 hours. After the temperature in the reaction kettle is naturally cooled to 165°C, Slowly enter water and cool to 85°C, add formaldehyde and stir for 10 minutes, then add triethylamine and ammonia water, and react at 100°C for 60 minutes, take samples to mea...

Embodiment 2

[0089] An embodiment of the present invention provides a method for manufacturing a composite matrix CEM-1 copper-clad laminate, including the following steps:

[0090] (1) Get the raw material of the described epoxidized soybean oil modified phenolic resin of following parts by weight: 1200 parts of epoxidized soybean oil, 500 parts of phenol, 1000 parts of bisphenol A, 5 parts of 2-methylimidazoles, 800 parts of formaldehyde , 90 parts of triethylamine, 45 parts of ammonia water, 2500 parts of methanol, 25 parts of graphene, and 20 parts of graphene oxide;

[0091] Add epoxidized soybean oil, phenol, and bisphenol A to the reaction kettle in turn, stir for 10 minutes to mix, then add 2-methylimidazole, and react at 180°C for 6 hours. After the temperature in the reaction kettle is naturally cooled to 165°C, Slowly enter water and cool to 85°C, add formaldehyde and stir for 10 minutes, then add triethylamine and ammonia water, and react at 105°C for 45 minutes, then take a sa...

Embodiment 3

[0095] An embodiment of the present invention provides a method for manufacturing a composite matrix CEM-1 copper-clad laminate, including the following steps:

[0096] (1) Get the raw material of the described epoxidized soybean oil modified phenolic resin of following parts by weight: 1450 parts of epoxidized soybean oil, 700 parts of phenol, 1100 parts of bisphenol A, 8 parts of 2-methylimidazoles, 1200 parts of formaldehyde , 70 parts of triethylamine, 30 parts of ammonia water, 2800 parts of methanol, 35 parts of graphene, 22 parts of graphene oxide;

[0097] Add epoxidized soybean oil, phenol, and bisphenol A to the reaction kettle in turn, stir for 10 minutes to mix, then add 2-methylimidazole, and react at 150°C for 6 hours. After the temperature in the reaction kettle is naturally cooled to 165°C, Slowly enter water to cool to 85°C, add formaldehyde and stir for 10 minutes, then add triethylamine and ammonia water, and react at 95°C for 60 minutes, take samples to mea...

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Abstract

The invention provides a glue solution for a copper-clad plate, a composite based CEM-1 copper-clad plate, and preparation methods of the glue solution and the composite based CEM-1 copper-clad plate. The glue solution for the copper-clad plate comprises the raw materials in parts by weight: 1200-2000 parts of epoxy soybean oil modified phenolic resin, 1200-2000 parts of epoxy resin, 150-250 parts of phenolic resin, 300-700 parts of a flame retardant, 250-350 parts of a curing agent, 1-5 parts of a curing accelerant, 50-150 parts of an inorganic filler and 100-300 parts of an organic solvent. On one hand, the epoxy soybean oil modified phenolic resin provided by the invention has the advantages of simple preparation process, good product performance and wide application; on the other hand, the glue solution for the copper-clad plate has the advantages of simple preparation process, good product performance, wide application and good permeability to wood pulp paper; what is noteworthy is that the composite based CEM-1 copper-clad plate provided by the invention has the advantages of simple preparation process, relatively good punching property, relatively good soldering resistance and good processing performance.

Description

technical field [0001] The invention belongs to the technical field of production methods of copper-clad laminates, and in particular relates to a glue solution for copper-clad laminates, a composite base CEM-1 copper-clad laminate and a preparation method thereof. Background technique [0002] With the official implementation of the EU directives WEEE (Waste Electrical and Electronic Equipment) and RoHS (Restriction of Hazardous Substances), the global electronics industry has entered the era of lead-free soldering. Due to the increase of lead-free soldering temperature, higher requirements are put forward for the heat resistance and thermal stability of printed circuit copper clad laminates. [0003] Composite base copper clad laminate has good machinability, its mechanical strength, dielectric properties, water absorption, ion migration resistance, etc. are superior to paper base copper clad laminate, and its basic characteristics are equivalent to cloth base copper clad ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L61/14C08L63/00C08L61/06C08K13/02C08K5/523C08K5/521C08K3/22C08K5/315C08K5/3445C08K3/36C08G8/32B32B17/02B32B17/06B32B17/12B32B15/20B32B29/00B32B29/06B32B27/04B32B27/26B32B27/20B32B27/42B32B27/38
CPCB32B5/26B32B15/14B32B15/20B32B29/02B32B2260/028B32B2260/046B32B2262/101B32B2307/306B32B2307/3065B32B2361/00B32B2363/00B32B2457/08C08G8/32C08L61/14C08L2205/025C08L2205/035C08L63/00C08L61/06C08K13/02C08K5/523C08K5/521C08K3/2279C08K5/3155C08K5/3445C08K2003/2241C08K3/36
Inventor 曾金师李金梅黎忠良何庭玉
Owner 抚州市龙兴电子材料有限公司
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