Vibration diaphragm in MEMS microphone, and MEMS microphone

A microphone and combined technology, applied in the directions of plane diaphragm, diaphragm fixing/tightening, diaphragm structure, etc., can solve problems such as diaphragm rupture and damage, microphone failure, etc., to meet performance requirements and avoid damage Effect

Active Publication Date: 2017-02-01
GOERTEK MICROELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] When the MEMS microphone is subject to mechanical shock, blowing, or falling, the MEMS chip will be subjected to a large sound pressure impact, which will often cause the diaphragm to be subjected to excessive pressure and cause rupture and damage, resulting in the failure of the entire microphone

Method used

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  • Vibration diaphragm in MEMS microphone, and MEMS microphone
  • Vibration diaphragm in MEMS microphone, and MEMS microphone
  • Vibration diaphragm in MEMS microphone, and MEMS microphone

Examples

Experimental program
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Effect test

Embodiment 1

[0038] The arc-shaped slit of the present invention can be provided with two, three or more. In a specific embodiment of the present invention, the arc-shaped slit is provided with two sections, which are respectively denoted as the first slit 5 and the second slit. Gap 6. refer to figure 2 , the first slit 5 and the second slit 6 are respectively in the shape of a non-closed circular arc, the size and shape of the two slits are consistent, and the two are connected together to form an S shape as a whole, and relative to their connected positions Centrosymmetric. The first slit 5 and the second slit 6 of the present invention can be formed simultaneously, for example, the first slit 5 and the second slit 6 of the present invention can be formed by etching the diaphragm body 1 .

[0039] Since the first slit 5 and the second slit 6 are set on the diaphragm body 1, the first slit 5 and the second slit 6 jointly form the first valve flap 3 and the second valve flap on the diap...

Embodiment 2

[0043] In this embodiment, in order to increase the pressure relief capacity of the pressure relief device 2, the arc-shaped slit is provided with three sections, which are respectively recorded as the first slit 5, the second slit 6, and the third slit 5a that are sequentially connected together. ,refer to Figure 4 . Based on a similar principle to Embodiment 1, the first slit 5, the second slit 6, and the third slit 5a jointly form a first valve flap, a second valve flap, and a third valve flap on the diaphragm body 1, and The first valve flap is connected to the first neck of the diaphragm body, the second valve flap is connected to the second neck of the diaphragm body, and the third valve flap is connected to the third neck of the diaphragm body.

[0044] The first slit 5, the second slit 6, and the third slit 5a are respectively in the shape of a non-closed arc, and the size and shape of the three slits are consistent, so that after the three slits are connected togeth...

Embodiment 3

[0049] In this embodiment, the arc-shaped slit is provided with four sections, which are respectively recorded as the first slit 5, the second slit 6, the third slit 5a, and the fourth slit 6a which are sequentially connected together. Refer to Figure 5 . These four gaps together form the first disc, the second disc, the third disc, and the fourth disc on the diaphragm body 1, and respectively connect the first disc, the second disc, and the third disc. 1. The fourth disc and the first neck, the second neck, the third neck, and the fourth neck of the diaphragm body 1 . The structure of this embodiment is similar to that of Embodiment 3, and will not be described in detail here.

[0050] The vibrating membrane of the present invention can be applied in MEMS microphones, thereby improving the anti-sound pressure capability of MEMS microphones, for this reason, the present invention also provides a kind of MEMS microphone, and it comprises substrate, back pole, and forms flat c...

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PUM

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Abstract

The invention discloses a vibration diaphragm in a MEMS microphone, and the MEMS microphone. The vibration diaphragm comprises a vibration diaphragm body and at least one pressure relief device; the at least one pressure relief device is on the vibration diaphragm body and formed by gaps; the gaps include at least two sections of circular arc-shaped gaps, which are continued together in sequence, wherein the whole of the adjacent two sections of circular arc-shaped gaps is S-shaped, and is centrosymmetric corresponding to a connection position; the pressure relief device comprises at least two valve clacks and neck parts; the at least two valve clacks are formed by at least two sections of adjacent circular arc-shaped gaps; and the neck parts are connected to the valve clacks and the vibration diaphragm body and shaped as constraint structures. When the vibration diaphragm disclosed by the invention is subjected to relatively high sound pressure due to mechanical shock, blowing, falling and the like, the at least two structure symmetrical valve clacks can upwarp upwardly or downwardly by taking respective neck parts as pivots; therefore, a effective pressure relief path is formed; and thus, the pressure relief purpose is achieved.

Description

technical field [0001] The present invention relates to a vibrating membrane for sounding, more precisely, to a vibrating membrane in a MEMS microphone; the present invention also relates to a MEMS microphone. Background technique [0002] MEMS (Micro-Electro-Mechanical Systems) microphones are microphones manufactured based on MEMS technology. The diaphragm and back plate are important components of the MEMS microphone. conversion. The traditional manufacturing process of the diaphragm is to make a layer of oxide layer on the silicon substrate, and then make a layer of diaphragm on the oxide layer by deposition. After doping and tempering, etch out the required graphics, the diaphragm Fastened to the base by rivet points on its edges. Of course, it is also necessary to lead out the electrodes from the diaphragm, and through the vibration of the diaphragm, the distance between the diaphragm and the back plate is changed, thereby converting the sound signal into an electric...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R7/00H04R19/04
CPCH04R7/00H04R19/04H04R19/005H04R7/04H04R7/16H04R2201/003
Inventor 詹竣凯蔡孟锦
Owner GOERTEK MICROELECTRONICS CO LTD
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