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LED lamp cooling fin capable of facilitating cooling

A technology of LED lamps and heat sinks, applied in lighting and heating equipment, semiconductor devices of light-emitting elements, cooling/heating devices of lighting devices, etc., can solve the problems of poor thermal conductivity and heat resistance, reduced lamp life, and easy thermal deformation And other problems, to achieve long service life, good heat dissipation effect

Inactive Publication Date: 2017-01-11
ANHUI FUN OPTOELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Most of the heat sinks used in LED lamps in the prior art have defects such as poor thermal conductivity and heat resistance, easy thermal deformation, poor tensile yield strength, and easy breakage, which greatly reduces the life of the lamp.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0013] A heat sink for LED lights that facilitates heat dissipation, comprising the following raw materials in parts by mass: 20 parts of silicon carbide, 20 parts of silicone resin, 13 parts of corn starch, 5 parts of dimethyl itaconate, 3 parts of graphite, and a curing agent 3 parts of diethylaminopropylamine, 5 parts of sodium fluorosilicate, 0.3 parts of magnesium isooctanoate, 0.2 parts of silicon nitride, 0.5 parts of magnesium sulfate, 0.2 parts of zirconium oxide, 0.2 parts of dichromium trioxide, 0.5 parts of vanadium diboride, 0.5 part of zirconium diboride, 0.5 part of sodium zeolite, 0.1 part of tea vinyl acetate, 15 parts of kaolin, 0.1 part of zinc oxide, 0.1 part of calcium carbonate, and 0.1 part of lignin.

Embodiment 2

[0015] A heat sink for LED lights that facilitates heat dissipation, comprising the following raw materials in parts by mass: 25 parts of silicon carbide, 25 parts of silicone resin, 14 parts of corn starch, 8 parts of dimethyl itaconate, 6 parts of graphite, curing agent 6 parts of diethylaminopropylamine, 6 parts of sodium fluorosilicate, 0.5 parts of magnesium isooctanoate, 0.3 parts of silicon nitride, 0.8 parts of magnesium sulfate, 0.3 parts of zirconia, 0.3 parts of dichromium trioxide, 0.8 parts of vanadium diboride, 0.8 parts of zirconium diboride, 0.8 parts of sodium zeolite, 0.2 parts of tea vinyl acetate, 18 parts of kaolin, 0.2 parts of zinc oxide, 0.2 parts of calcium carbonate, and 0.2 parts of lignin.

Embodiment 3

[0017] A heat sink for LED lights that facilitates heat dissipation, comprising the following raw materials in parts by mass: 22 parts of silicon carbide, 22 parts of silicone resin, 13 parts of corn starch, 6 parts of dimethyl itaconate, 5 parts of graphite, and a curing agent 4 parts of diethylaminopropylamine, 5 parts of sodium fluorosilicate, 0.4 parts of magnesium isooctanoate, 0.2 parts of silicon nitride, 0.7 parts of magnesium sulfate, 0.2 parts of zirconium oxide, 0.2 parts of dichromium trioxide, 0.6 parts of vanadium diboride, 0.6 part of zirconium diboride, 0.6 part of sodium zeolite, 0.2 part of tea vinyl acetate, 16 parts of kaolin, 0.1 part of zinc oxide, 0.1 part of calcium carbonate, and 0.1 part of lignin.

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PUM

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Abstract

The invention discloses an LED lamp cooling fin capable of facilitating cooling. The cooling fin is prepared from, by mass, 20-25 parts of silicon carbide, 20-25 parts of organic silicon resin, 13-14 parts of corn starch, 5-8 parts of itaconic acid ester, 3-6 parts of graphite, 3-6 parts of curing agent, namely diethylaminopropylamine, 5-6 parts of sodium fluosilicate, 0.3-0.5 part of magnesium isooctanoate, 0.2-0.3 part of silicon nitride, 0.5-0.8 part of magnesium sulfate, 0.2-0.3 part of zirconia, 0.2-0.3 part of chromium sesquioxide, 0.5-0.8 part of vanadium boride, 0.5-0.8 part of zirconium diboride, 0.5-0.8 part of natrolite, 0.1-0.2 part of tea leaf vinyl acetate, 15-18 parts of kaolin, 0.1-0.2 part of zinc oxide, 0.1-0.2 part of calcium carbonate and 0.1-0.2 part of lignin. The prepared LED lamp cooling fin is resistant to high temperature and ageing, good in cooling effect and long in service life.

Description

technical field [0001] The invention relates to the field of LED lamp materials, in particular to a heat sink for LED lamps that facilitates heat dissipation. Background technique [0002] LED is a semiconductor light-emitting diode. LED energy-saving lamps use high-brightness white light-emitting diodes as light sources. They have high luminous efficiency, low power consumption, long life, easy control, maintenance-free, safety and environmental protection; Bright, colorful, low loss, low energy consumption, green and environmental protection. [0003] LED lamps, the full name of light-emitting diode lamps, refer to appliances that can transmit light, distribute and change the light distribution of LED light sources. With its technical characteristics of high efficiency, energy saving, longevity, and compactness, LED lamps have effectively promoted the rapid development of the environmental protection and energy saving industry. Due to the light generation characteristics...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/04C08L3/02C08L97/00C08K13/04C08K3/34C08K3/04C08K5/098C08K7/26F21V29/74F21Y115/10
CPCC08L83/04C08K2201/014C08L2201/08C08L2203/20C08L2205/03F21V29/74C08L3/02C08L97/005C08K13/04C08K3/34C08K3/04C08K5/098C08K7/26C08K3/346
Inventor 汪卫国
Owner ANHUI FUN OPTOELECTRONICS TECH
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