Semiconductor overlaying low-temperature energy storage refrigeration device and working method thereof

Abstract

The invention discloses a semiconductor overlaying low-temperature energy storage refrigeration device and a working method thereof. The semiconductor overlaying low-temperature energy storage refrigeration device comprises a compressor, a hot end energy storage heat exchanger, a liquid storage device, a throttle valve and a cold end energy storage heat exchanger, all of which communicate in sequence according to the refrigerating medium flow path. The cold end energy storage heat exchanger comprises at least one set of box type or shell-coiled pipe type cold end evaporator, and the hot end energy storage heat exchanger comprises at least one set of box type or shell-coiled pipe type hot end condenser. A semiconductor chilling plate is attached to at least one heat radiation plane of each of the cold end evaporators and the hot end condensers. Cold and hot end medium cavities for containing energy storage media are formed in the outer portions of the other faces of the semiconductor chilling plates. Cold and hot end medium temperature probes are arranged in the medium cavities correspondingly. Temperature probes and pressure probes are arranged between an outlet of the cold end energy storage heat exchanger and the compressor. According to the semiconductor overlaying low-temperature energy storage refrigeration device and the working method, the system internal stability and heat exchange efficiency are improved, and the energy consumption ratio is correspondingly reduced. By means of the energy storage media, the refrigerating fluid operation condition can be relatively stable, the energy storage device is flexible in configuration, and combination can be carried out according to the system size.

Description

technical field [0001] The invention relates to a semiconductor-stacked low-temperature energy storage refrigeration device and a working method thereof. In particular, it involves an overlay of semiconductor refrigeration and traditional refrigeration systems, which solves the problems of energy loss in the refrigeration process and the decline in refrigeration efficiency at low temperatures, and can utilize the heat generated in the process to reduce the burden on the environment. Background technique [0002] The traditional refrigeration system consists of four major components, a compressor, a condenser, a throttle valve (expansion valve), and an evaporator, forming an internal circulation system. The compressor compresses the low-temperature and low-pressure gaseous refrigerant into a high-pressure and high-temperature refrigerant. gaseous refrigerant. Through the condenser, it becomes a high-pressure and low-temperature liquid refrigerant; through the throttling valv...

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Problems solved by technology

Two key factors that affect heat transfer efficiency are heat transfer area and temperature difference, the air cooling form is limited and the external ambient temperature, so when the ambient temperature difference is large, there is a great difference in the cooling capacity that the refrigeration system can produce, and it is also It has caused many unstable factors to the refrigeration system. If the adjustment range of the expansion valve is exceeded, it is likely to cause high energy consumption or damage the compressor.

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