Polishing method for gallium antimonide single crystal wafer
A single wafer, gallium antimonide technology, applied in the polishing field of gallium antimonide single wafer, can solve the problems of difficulty in processing high-quality polished wafers, difficult control of the chemical effect of gallium antimonide, high brittleness of gallium antimonide materials, etc. To achieve the effect of small surface damage, easy operation and easy cleaning
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[0016] The first step of rough polishing: the rough polishing uses a cerium oxide polishing pad, the polishing liquid contains aluminum oxide abrasives with a particle size of W1, and the polishing pressure is 160 g / cm 2 , the rotation speed is 30 rpm, and the flow rate of the polishing solution is 30 mL / min. The polishing liquid used for rough polishing is made by mixing the following components by weight percentage: W1 alumina abrasive 25%; grinding aid 6.5%; dispersant 4.5%; deionized water 64%.
[0017] The second step is polishing: the middle polishing uses a black polyurethane polishing pad, the polishing liquid contains silica nano-abrasives with a particle size of 75 nm and the oxidizing agent sodium hypochlorite, and the polishing pressure is 120 g / cm 2 , the rotational speed is 85 rpm, and the flow rate of the polishing solution is 20 mL / min. The polishing liquid used in polishing is made by mixing the following components by weight percentage: particle size is 20% ...
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