Novel diamond abrasive wire cutting fluid

Abstract

The invention discloses a novel diamond abrasive wire cutting fluid. The novel diamond abrasive wire cutting fluid comprises, by mass, 1 to 50 parts of deionized water, 30 to 90 parts of polyether, 0.1 to 1.0 part of a thickening agent, 0.1 to 1.0 part of a settling agent, 0.1 to 1.0 part of a dispersing agent and 0.1 to 1.0 part of an antifoaming agent. The diamond abrasive wire cutting fluid provided by the invention can inhibit generation of hydrogen, has obvious lubrication effect, is easy to clean, low in cost, stable in performance and friendly to environment, has low COD value and can be directly discharged.

Description

technical field [0001] The invention relates to a novel diamond sand wire cutting fluid. Background technique [0002] In the cutting process of various ultra-hard and brittle materials (single crystal silicon, polycrystalline silicon, germanium, gallium arsenide, quartz, indium gallium nitride, gemstones, non-metallic materials, etc.). The traditional cutting process uses a mortar suspension, which consists of the suspension and silicon carbide. The high-speed movement of the steel wire causes the suspension to carry the angular silicon carbide particles into the cutting area in a rolling manner. Due to a certain tension on the steel wire, the silicon carbide abrasive generally only gradually moves along the direction of the steel wire. The workpiece is cut again and again, so that the workpiece is cut into thin slices along the gap of the thin steel wire, but the cutting efficiency is low. [0003] As described in CN 102285011A, the diamond sand wire cutting process is a...

AI Technical Summary

Problems solved by technology

[0004] Existing diamond sand wire cutting fluid, as described in CN201210045299, has been gradually phased out now due to its high use concentration (the use concentration is 30% during cutting), and the discharged sewage COD value is relatively high.

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