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Electric copper plating liquid and electric copper plating process thereof

A technology of electroplating copper and plating solution, which is applied in the direction of jewelry, etc., and can solve the problems of accelerating copper deposition on the board surface and decreasing TP value

Active Publication Date: 2016-08-24
GUANGDONG GUANGHUA SCI TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, for a flexible board with a very small thickness, the easier the solution exchange, it also means that the distribution of organic additives inside and outside the hole will also change accordingly. Copper deposition in the hole, and the accelerator originally adsorbed in the hole is more adsorbed on the board surface to accelerate the copper deposition on the board surface because the adsorption site is occupied by the leveler, which leads to a decrease in TP value

Method used

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  • Electric copper plating liquid and electric copper plating process thereof
  • Electric copper plating liquid and electric copper plating process thereof
  • Electric copper plating liquid and electric copper plating process thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0050] What present embodiment adopts is that Rohm and Haas Company produces COPPER GLEAM TM ST-920 electroplating solution additive (typical three-component formula), according to the instruction manual, prepare the electroplating solution according to the following formula.

[0051] Copper sulfate pentahydrate: 70g / L

[0052] Sulfuric acid: 220g / L

[0053] Chloride ion: 60mg / L

[0054] The components of ST920 electroplating solution additives are added according to the concentration of the instructions:

[0055] ST920 Brightener: 2.75mL / L

[0056] ST920 inhibitor: 17.5mL / L

[0057] ST920 leveling agent: 3.25mL / L

[0058] ST920 stabilizer: 5mL / L

[0059] Deionized water: balance.

[0060] After a series of pre-treatments are performed on the flexible board of a specific specification, that is, degreasing, water washing, and pre-soaking, electroplating is performed in the above-mentioned copper plating solution. In this embodiment, the black-holed flexible plate to be...

Embodiment 2

[0062] What this embodiment adopts is the additive of electroplating bath of MACUSPEC VP100 produced by Mai Demei Company (this formula does not contain leveling agent, but the brightening agent it uses is different from the present invention). Prepare the electroplating solution according to the following recipe according to the instruction manual.

[0063] Copper sulfate pentahydrate: 120g / L

[0064] Sulfuric acid: 200g / L

[0065] Chloride ion: 70mg / L

[0066] The components of VP100 electroplating solution additives are added according to the concentration in the instructions:

[0067] VP100 Brightener: 1mL / L

[0068] VP100 inhibitor: 10mL / L

[0069] Deionized water: balance.

[0070] After a series of pre-treatments are performed on the flexible board of a specific specification, that is, degreasing, water washing, and pre-soaking, electroplating is performed in the above-mentioned copper plating solution. In this embodiment, the black-holed flexible plate to be plat...

Embodiment 3

[0072] What this embodiment adopts is the additive of electroplating plating solution of MACUSPEC VP100 produced by Mai Demei Company. Prepare the electroplating solution according to the following recipe according to the instruction manual.

[0073] Copper sulfate pentahydrate: 120g / L

[0074] Sulfuric acid: 200g / L

[0075] Chloride ion: 70mg / L

[0076] The components of VP100 electroplating solution additives are added according to the concentration in the instructions:

[0077] VP100 Brightener: 1mL / L

[0078] VP100 inhibitor: 10mL / L

[0079] Deionized water: balance.

[0080] After a series of pre-treatments are performed on the flexible board of a specific specification, that is, degreasing, water washing, and pre-soaking, electroplating is performed in the above-mentioned copper plating solution. In this embodiment, the black-holed flexible board to be plated is used as the negative electrode, and the soluble phosphorus-containing copper is used as the anode. The s...

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Abstract

The invention relates to an electric copper plating liquid and an electric copper plating process thereof. The electric copper plating liquid is made with the following components: 20 g / l of copper sulfate pentahydrate, 20 g / L-300 g / L of sulfuric acid, 25 g / L-120 mg / L of chlorine ion, 0.1 mg / L-20 mg / L of a brightening agent, 1 mg / L-2000 mg / L of an inhibitor, and the balance of deionized water; the brightening agent is selected from alkyl thiol sulfonate or two of its derivatives; the inhibitor is selected from one or any of nonionic surfactants. The electric copper plating liquid of the invention enables greatly improved plating current and greatly improved throwing power (TP) of flexible board through-hole plating, TP reaching to higher than 200%, an electric copper plating layer in each hole is flat, and the quality meets various requirements of flexible board.

Description

technical field [0001] The invention relates to the technical field of printed circuit board manufacturing, in particular to a copper electroplating bath and a copper electroplating process. Background technique [0002] Flexible printed circuit board (Flexible Printed Circuit Board), also known as "FPC flexible board", is a printed circuit board made of flexible insulating substrates. The flexible board has the characteristics of small size and light weight, which can greatly reduce the volume of the device and meet the needs of electronic products in the direction of high density, miniaturization, light weight, thinning, and high reliability. In addition, it is also highly flexible and can be freely bent, wound, twisted, folded, and its shape can be changed arbitrarily according to the requirements of the space layout. Integration of connections. At the same time, the FPC flexible board also has the advantages of good heat dissipation, solderability and easy assembly. D...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/38C25D7/00C25D5/10
CPCC25D3/38C25D5/10C25D5/34C25D5/627C25D5/617C25D5/48
Inventor 王翀彭佳程骄肖定军何为
Owner GUANGDONG GUANGHUA SCI TECH
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