Production process of electric and light source integrated light emitting diode (LED) aluminum-based circuit board

Abstract

The invention relates to a production process for an electric and light source integrated light emitting diode (LED) aluminum-based circuit board. A finished product is obtained according to the following steps of surface processing on an aluminum plate, head conduction adhesive fabrication, coating, composite copper foil lamination, cutting, positioning hole drilling, pre-processing, circuit pattern forming, etching and film removal, positioning hole by a target process, circuit on / off test, solder resistant white oil coating, exposure, development, character printing and curing, punching, v-shaped cutting and anti-oxidation process, wherein in the step of coating, the heat conduction adhesive is sprayed by a curtain formed by a spraying cutter. By the process, an aluminum-based circuit integrated with a light source and an electric source can be produced at a large scale, and the fabricated LED and the electric source both have favorable heat dissipation performance.

Description

technical field [0001] The invention relates to the technical field of LED optoelectronics, in particular to a production process of an electric light source integrated LED aluminum-based circuit board. Background technique [0002] The pursuit of lightness and convenience is the current trend of LED lighting appliances. People expect an LED lighting appliance that integrates the power supply part and light source, which can greatly facilitate daily use. The production of aluminum-based circuit boards usually includes two parts: the production of aluminum-based copper-clad laminates and the production of aluminum-based circuit boards based on them. , there are following deficiencies in these several gluing methods: [0003] 1. Roll coating, the thickness of the glue is difficult to adjust, the thickness is uneven, and the production speed is slow: generally around 3-4m / min; 2. Printing, low efficiency, slow speed, small product size, generally the product width is below 60c...

AI Technical Summary

Problems solved by technology

[0003] 1. Roll coating, the thickness of the glue is difficult to adjust, the thickness is uneven, and the production speed is slow: generally around 3-4m / min; 2. Printing, low efficiency, slow speed, small product size, generally the product width is below 60cm , cannot produce large-scale aluminum-based copper-clad laminates with a size of 1m*2m; 3. Spray curtain, the product can be sprayed evenly, and large-scale plates can also be produced, but a large amount of colloidal substances are scattered in the air environment, which not only seriously affects the environment, but also a lot of waste of raw materials

[0004] Moreover, during the gluing process of the copper clad laminate, if there is dust on the surface or the flatness is not good, it will have an impact on the roller coating and printing process. Adhesion is not strong and other problems, which affect the quality of aluminum-based copper clad laminates

[0005] On the other hand, there are currently two ways to integrate the power supply part and the light source. One of the methods is to place the drive power supply part in the LED light source circuit directly on the aluminum-based circuit board in the form of a chip, and use AC- AC drive, this way LED has flicker phenomenon, and is affected by factors such as line surge, the driver chip is easily damaged, and the stability of LED lamps is seriously affected

Another method is to use the milled (or punched) size FR4 or CEM-1 board as the substrate, inlay it on the milled (or punched) aluminum plate of the same size, then coat the insulating layer and cover with copper The disadvantages of this method are that the processing cost is high, the production efficiency is very low, and it can only be manufactured in small quantities, and cannot be produced on a large scale; Due to the thickness error generated when the substrate and the aluminum plate itself are cut, the error that occurs when the substrate is embedded on the aluminum plate, and the dust generated during punching falls into the aluminum plate, these factors will seriously affect the insulation layer and the copper foil and the aluminum plate. Combination, which ultimately affects the peel strength, insulation and thermal conductivity of the product

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