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Manufacturing process for eliminating crystal defects of aluminium electrode

A crystal defect and manufacturing process technology, applied in semiconductor/solid-state device manufacturing, circuits, electrical components, etc., can solve problems such as crystal defects, achieve the effects of improving corrosion resistance, reducing production costs, and improving process quality

Active Publication Date: 2016-07-27
WUHAN XINXIN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the polymer compound containing fluorine element remains on the aluminum electrode during the dry etching process, it is impossible to avoid the corrosion of the aluminum electrode by the residual fluorine in the overtime environment, resulting in the formation of crystal defects.

Method used

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  • Manufacturing process for eliminating crystal defects of aluminium electrode
  • Manufacturing process for eliminating crystal defects of aluminium electrode

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Embodiment Construction

[0032] The principles and features of the present invention are described below in conjunction with the accompanying drawings, and the examples given are only used to explain the present invention, and are not intended to limit the scope of the present invention.

[0033] Such as figure 1 As shown, a schematic diagram of a manufacturing process for eliminating crystal defects of aluminum electrodes includes the following steps:

[0034] Step 1: forming an oxide layer 2 on the surface of the aluminum electrode 1;

[0035] Step 2: covering the surface of the aluminum electrode 1 with a masking layer 3, and the masking layer 3 is covered on the oxide layer 2, wherein the masking layer 3 is preset with an opening in a desired pattern shape;

[0036] Step 3: Expose the aluminum electrode 1 covered with the masking layer 3 by light 4 to decompose the part of the oxide layer 2 exposed from the opening until the aluminum electrode 1 with the desired pattern shape is completely expose...

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Abstract

The invention relates to a manufacturing process for eliminating crystal defects of an aluminium electrode. The manufacturing process comprises the following steps of: forming an oxide layer on the surface of the aluminium electrode; covering a covering layer on the surface of the aluminium electrode, wherein the covering layer covers the oxide layer; and an opening having a required pattern shape is preset on the covering layer; exposing the aluminium electrode, the surface of which is covered by the covering layer, decomposing the oxide layer from a part exposed from the opening till the aluminium electrode having the required pattern shape is exposed, and removing the covering layer; and performing plasma treatment of first active gas, and introducing the first active gas onto the surface of the aluminium electrode having the preset pattern shape from the opening, so that a moisture-proof protective layer is formed. According to the manufacturing process for eliminating the crystal defects of the aluminium electrode disclosed by the invention, oxides on the surface of the aluminium electrode are decomposed by utilizing illumination; a high-molecular compound including fluorine is prevented from being introduced; therefore, formation of the crystal defects is eliminated from the source; the quality of the aluminium electrode is improved; and the manufacturing process of the aluminium electrode in the prior art is optimized.

Description

technical field [0001] The invention relates to the technical field of aluminum electrode manufacturing technology, in particular to a manufacturing technology for eliminating crystal defects of aluminum electrodes. Background technique [0002] In the prior art, in the dry etching passivation process of the aluminum electrode, a dielectric layer is basically grown on the aluminum electrode, and then an opening of a specific shape is etched on the surface of the aluminum electrode by dry etching, and exposed aluminum electrodes. Since the polymer compound containing fluorine element remains on the aluminum electrode during the dry etching process, it is still impossible to avoid the corrosion of the aluminum electrode by the residual fluorine in the overtime environment, resulting in the formation of crystal defects. Contents of the invention [0003] The technical problem to be solved by the present invention is to aim at the deficiencies of the above-mentioned prior art...

Claims

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Application Information

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IPC IPC(8): H01L21/263H01L21/321
CPCH01L21/263H01L21/321H01L21/32138
Inventor 童浩陈俊
Owner WUHAN XINXIN SEMICON MFG CO LTD
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