Halogen-free thermosetting resin composition, prepreg prepared from halogen-free thermosetting resin composition and laminated plate for printed circuit

Abstract

The invention relates to a halogen-free thermosetting resin composition, a prepreg prepared from the halogen-free thermosetting resin composition and a laminated plate for a printed circuit. The halogen-free thermosetting resin composition comprises, by weight, 30-60 parts of halogen-free epoxy resin, 5-30 parts of phosphorus-containing bisphenol as a first curing agent, 5-30 parts of dicyclopentadiene-type phenolic aldehyde as a second curing agent and a phosphorus-containing fire retardant. The prepreg prepared from the halogen-free thermosetting resin composition and the laminated plate for a printed circuit have high glass-transition temperatures, excellent dielectric properties, low water absorption rates, high heat resistance and good processability, realizes halogen-free flame retardation and has a UL94V-0 level.

Description

technical field [0001] The invention relates to a halogen-free thermosetting resin composition, and also relates to a prepreg and a printed circuit laminate made of the halogen-free thermosetting resin composition. Background technique [0002] Traditional printed circuit laminates usually use brominated flame retardants to achieve flame retardancy, especially tetrabromobisphenol A epoxy resin, this brominated epoxy resin has good flame retardancy, but it is in Combustion produces hydrogen bromide gas. In addition, in recent years, carcinogens such as dioxin and dibenzofuran have been detected in the combustion products of electronic and electrical equipment wastes containing halogens such as bromine and chlorine, so the application of brominated epoxy resins is limited. On July 1, 2006, the EU's two environmental protection directives "Directive on Waste Electrical and Electronic Equipment" and "Directive on the Restriction of the Use of Certain Hazardous Substances in Ele...

AI Technical Summary

Problems solved by technology

Traditional FR-4 materials mostly use dicyandiamide as a curing agent. This curing agent has a tertiary reactive amine and has good process operability. However, due to its weak C-N bond, it is easy to crack at high temperature, resulting in the deterioration of the cured product. The thermal decomposition temperature is low, which cannot meet the heat resistance requirements of the lead-free process

In this context, with the large-scale implementation of lead-free technology in 2006, the industry began to use phenolic resin as the curing agent for epoxy. Phenolic resin has a high-density benzene ring structure, so it has the same heat resistance as the cured epoxy system. Excellent, but at the same time the dielectric properties of the cured product tend to be deteriorated

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