Vertical interconnection circuit structure between substrate-integrated ridge waveguide plates
A technology of substrate integration and circuit structure, applied in circuits, waveguide-type devices, electrical components, etc., can solve the problems of poor mutual isolation, complicated installation process, and large volume of air waveguides.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0017] refer to figure 1 with figure 2 . In the embodiment described below, a substrate-integrated ridge waveguide interconnection circuit structure includes two LTCC multilayer circuit boards 1 with the same conversion circuit structure, and the SIRW 3 interface is metal-etched on the surface of the substrate. The Z-direction metallized filling hole 2 equivalently constitutes the waveguide wall of SIRW 3 and the single-sided equivalent dielectric waveguide ridge 10 in the waveguide, the waveguide short-circuit surface 5, and the 50-ohm stripline 8 and stripline 8 that are matched and connected through the high-resistance stripline 9. A linear probe 6, wherein: on the LTCC multilayer circuit board 1, a SIRW3 perpendicular to the surface of the substrate is integrated, and a substrate integrated ridge waveguide opening is etched on the corresponding exit of the metal ground on the surface of the LTCC multilayer circuit board 1; Z direction The metallized filling hole 2 is ...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com