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Resin CBN grinding disc for grinding copper alloy

A grinding disc and copper alloy technology, which is applied in the field of grinding wheel manufacturing, can solve the problems of unknowable product formula, easy blockage of grinding wheel by grinding debris, high roughness value, etc., and achieve the effect of not easily deformed, low roughness value and good thermal conductivity

Active Publication Date: 2016-06-08
沈阳中科超硬磨具磨削研究所
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Common problems in the grinding process of copper alloys: 1) grinding debris is easy to block the grinding wheel; 2) the surface of the workpiece is easy to scratch, and the roughness value is high; 3) the workpiece is easy to deform; 4) the grinding efficiency is low, and the scrap rate in production is very high high
Existing grinding discs generally use imported products, such as Japan's Toyota Wanmo series products, and their product formulas cannot be known

Method used

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  • Resin CBN grinding disc for grinding copper alloy
  • Resin CBN grinding disc for grinding copper alloy

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0007] 1. Prepare the matrix according to the general method;

[0008] 2. Preparation of a working abrasive layer; the working abrasive layer includes a resin bond and a mixed filler; the resin bond is an ultrafine phenolic resin; the mixed filler is calculated by volume ratio: ultrafine silicon carbide 15 with a particle size of 20 μm, Nanoscale SiO with a particle size of 0.05μm 2 3. Glass beads with a particle size of 8 μm 10, ultrafine copper powder with a particle size of 0.5 μm 5, ultrafine kaolin with a particle size of 20 μm 1, ultrafine talc powder with a particle size of 20 μm 1, nano-sized polytetrafluoroethylene powder with a particle size of 0.05 μm 1; diamond 1, CBN25.

[0009] The working abrasive layer is integrated with the substrate according to the general method, that is, the CBN grinding disc;

Embodiment 2

[0011] 1. Prepare the matrix according to the general method;

[0012] 2. Preparation of a working abrasive layer; the working abrasive layer includes a resin bond and a mixed filler; the resin bond is an ultrafine phenolic resin; the mixed filler is calculated by volume ratio: ultrafine silicon carbide 20 with a particle size of 10 μm, Nanoscale SiO with a particle size of 0.03μm 2 5. Glass beads with a particle size of 15 μm 5, ultrafine copper powder with a particle size of 1.0 μm 8, ultrafine kaolin with a particle size of 15 μm 10, ultrafine talc powder with a particle size of 15 μm 3, nano-sized polytetrafluoroethylene powder with a particle size of 0.03 μm 2; diamond 10, CBN10.

[0013] The working abrasive layer is integrated with the substrate according to the general method, that is, the CBN grinding disc;

Embodiment 3

[0015] 1. Prepare the matrix according to the general method;

[0016] 2. Preparation of a working abrasive layer; the working abrasive layer includes a resin bond and a mixed filler; the resin bond is an ultrafine phenolic resin; the mixed filler is calculated by volume ratio: ultrafine silicon carbide 17 with a particle size of 15 μm, Nanoscale SiO with a particle size of 0.04μm 2 4. Glass beads with a particle size of 12 μm 8, ultrafine copper powder with a particle size of 0.7 μm 10, ultrafine kaolin with a particle size of 17 μm 5, ultrafine talc powder with a particle size of 18 μm 2, nano-sized polytetrafluoroethylene powder with a particle size of 0.04 μm 3; diamond 6. CBN15.

[0017] The working abrasive layer is integrated with the substrate according to the general method, that is, the CBN grinding disc;

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Abstract

The invention discloses a resin CBN grinding disc for grinding copper alloy. The grinding disc is composed of a base body and a working abrasive layer; the working abrasive layer comprises resin binders and mixed filler; the resin binders are superfine phenolic resin; the mixed filler is composed of, by volume ratio, 15-20% of superfine silicon carbide with the grain size ranging from 10 micrometers to 20 micrometers, 3-5% of nanoscale silicon dioxide with the grain size ranging from 0.03 micrometer to 0.05 micrometer, 5-10% of glass beads with the grain size ranging from 8 micrometers to 15 micrometers, 5-15% of ultra-fine copper powder with the grain size ranging from 0.5 micrometer to 1.0 micrometer, 1-10% of superfine kaolin with the grain size ranging from 15 micrometers to 20 micrometers, 1-3% of superfine talcum powder with the grain size ranging from 15 micrometers to 20 micrometers, 1-5% of nanoscale polytetrafluoroethylene powder with the grain size ranging from 0.03 micrometer to 0.05 micrometer, 1-10% of diamonds and 10-25% of CBN. The grinding disc has the advantages that the heat conductivity is good, and burning of work-pieces does not occur easily; the grinding efficiency is high, and a cutting edge is sharp; the work-pieces do not deform easily; the roughness value is low, and the dimensional accuracy is within 0.003 millimeter; and blockage of a grinding wheel does not occur easily.

Description

technical field [0001] The invention relates to the technical field of grinding wheel manufacturing, in particular to a CBN grinding disc. Background technique [0002] Common problems in the grinding process of copper alloys: 1) grinding debris is easy to block the grinding wheel; 2) the surface of the workpiece is easy to scratch, and the roughness value is high; 3) the workpiece is easy to deform; 4) the grinding efficiency is low, and the scrap rate in production is very high high. Existing grinding discs generally adopt imported products, such as Japan's Toyota Wanmo series products, and its product formula cannot be known. Contents of the invention [0003] In order to solve the above technical problems, the purpose of this invention is to provide a kind of CBN grinding disc, which can meet the technical requirements in production, and the specific technical scheme is as follows: [0004] A resin CBN grinding disc for grinding copper alloy is characterized in that:...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D3/34B24D3/28B24B37/11
CPCB24B37/11B24D3/285B24D3/344B24D3/346
Inventor 郑师光王雀郑勇阁王昆
Owner 沈阳中科超硬磨具磨削研究所
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