Method for fabricating micro-inductors based on 3D printing

A 3D printing, micro-inductance technology, applied in the direction of inductors, circuits, additive manufacturing, etc., can solve the problems of complex processing technology, difficult processing of ferromagnetic materials, difficult IC technology, etc. The incompatibility of materials and semiconductor processes, the effect of reducing the difficulty of preparation and processing

Active Publication Date: 2018-08-10
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the problems of complex preparation and processing of traditional micro-inductors, difficulty in preparation and processing of ferromagnetic materials, and difficulty in combining IC technology, and provide a method for preparing micro-inductors based on 3D printing. The present invention combines 3D printing technology with micro The combination of inductance technology, the application of external magnetic field and selective local preparation of ferromagnetic materials, realize the large-scale preparation of high-performance on-chip micro-inductors

Method used

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  • Method for fabricating micro-inductors based on 3D printing
  • Method for fabricating micro-inductors based on 3D printing
  • Method for fabricating micro-inductors based on 3D printing

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Embodiment 1

[0053] In this embodiment, the prepared micro-inductance coil is a three-dimensional spiral inductor. The three-dimensional spiral inductor prepared based on 3D printing in this embodiment is as follows: figure 2 shown. Among them, 101 is the substrate for processing the micro-inductor, 103 is the coil of the micro-inductor, 104 is the area for 3D printing ferromagnetic materials, 105 and 108 are the nozzles for 3D printing the micro-inductance coil, 106 and 109 are Cu powder and iron for the micro-inductance coil Magnetic material powder; 107 is the laser required for processing, and 110 is the direction of applying an external magnetic field while printing the magnetic material.

[0054] The diameter of the three-dimensional spiral micro-inductance coil in this embodiment is 100 μm, the coil diameter is 8 μm, the distance between coil layers is 20 μm, and the number of coil layers is 10.

[0055] The preparation method of the present embodiment comprises the following step...

Embodiment 2

[0065] In this embodiment, the micro-inductance coil is a planar micro-inductor. The preparation method comprises the following steps:

[0066] 1) First deposit 500nm SiO on a high-resistance Si substrate 2 film;

[0067] 2) Then use electron beam evaporation to deposit 200nmTi / Au as a buffer layer and bottom electrode to improve the combination of the micro-inductance coil and the substrate;

[0068] 3) Then deposit 3 μm metal Cu as the metal material of the micro-inductance coil, and use the MEMS process to process the metal Cu film into a micro-inductance coil 21 and an electrode 11, the electrode size is 300um*500um, the outer diameter of the coil is 500 μm, and the coil width is 15 μm. The pitch between the coils was 25 μm, and the number of coils was 4 turns. Such as image 3 shown.

[0069] 4) Use the 3D printing nozzle to print the ferromagnetic material NiZnCuFeO in the upper area of ​​the micro-inductance coil, with a thickness of 500nm. Oxygen material is crys...

Embodiment 3

[0073] In this embodiment, the micro-inductance coil is a planar micro-inductor. The preparation method comprises the following steps:

[0074] 1) First thermally oxidize the high-resistance Si substrate, and deposit 500nm SiO on the substrate surface 2 film;

[0075] 2) Then use electron beam evaporation to deposit 200nmTi / Au as a buffer layer and a seed layer to improve the combination of the micro-inductance coil and the substrate;

[0076] 3) Then use PECVD to grow an insulating layer SiO with a thickness of 500nm 2 , again using photolithography and dry etching on insulating SiO 2A through hole with a size of 20um*20um is formed on the top;

[0077] 4) Again using magnetron sputtering on SiO 2 500nm Ti / Au is grown on the insulating layer as a through hole to connect the upper and lower electrodes;

[0078] 5) Subsequently, deposit a 3 μm metal Cu metal material film layer on the sample made in step 5), and use the MEMS process to process the metal Cu film layer into...

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Abstract

The invention relates to a method for preparing a micro-inductor based on 3D printing, and belongs to the technical field of micro-inductor production. The micro-inductor prepared by printing is a three-dimensional inductor or a planar micro-inductor; the method comprises: firstly depositing a SiO2 film on a substrate; using electron beams Evaporation deposition acts as a buffer layer and seed layer to improve the combination of the micro-inductance coil and the substrate; deposit metal material films as micro-inductance coils; use MEMS technology to process metal films into micro-inductance coils and electrodes; use 3D printing nozzles in the micro-inductance coil The ferromagnetic material is printed in the upper area of ​​​​the ferromagnetic material; the ferromagnetic material is sintered and an external magnetic field in the same direction is applied at the same time to crystallize the ferrite material, and the magnetic moment orientation is uniform, which is beneficial to improve the permeability and saturation of the ferrite material. magnetization. The invention combines the 3D printing technology with the micro-inductance technology, adopts the application of an external magnetic field and selectively prepares ferromagnetic materials locally, and realizes the large-scale preparation of high-performance on-chip micro-inductors.

Description

technical field [0001] The invention belongs to the technical field of manufacturing micro-inductors, in particular to a method for preparing micro-inductors based on 3D printing. Background technique [0002] In the past few decades, the rapid development of semiconductor information technology has promoted the development of electronic products in the direction of high integration, miniaturization, intelligence, and low power consumption. The ultimate goal is to realize various functional units in a single chip. superior. At present, the promotion and development of 4G, 5G mobile communication and Internet of Things technology, power management and high-speed data transmission have higher and higher requirements for IC integrated circuits. As an indispensable passive inductive device in IC integrated circuits, micro-inductors can convert electrical energy into magnetic energy, and can realize "low-pass high-resistance" of AC signals, and are gradually applied to power ene...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/02B22F3/105
CPCH01L28/10B22F10/00B22F10/64B22F12/55B22F12/53B22F10/28Y02P10/25
Inventor 任天令刘厚方王刚邱皓川李晓宁杨轶
Owner TSINGHUA UNIV
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