Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Mask group suitable for multi-overlay multi-time sequence photoetching pattern and fabrication method of mask group

A photolithographic pattern and mask technology, which is applied to the photoengraving process of the pattern surface, the original for optical mechanical processing, optics, etc. Micro-machining flexibility and other issues, to achieve the effect of facilitating the processing process, saving the quantity and reducing the cost

Pending Publication Date: 2016-06-01
BEIHANG UNIV
View PDF9 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention provides a mask group and a manufacturing method suitable for multi-sequence photolithography patterns for multiple overlaying, which are used to solve the problem that the pattern of the mask plate set in the prior art is not easy to change, resulting in difficult change of the processing sequence, and further Issues Affecting Micromachining Flexibility

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Mask group suitable for multi-overlay multi-time sequence photoetching pattern and fabrication method of mask group
  • Mask group suitable for multi-overlay multi-time sequence photoetching pattern and fabrication method of mask group
  • Mask group suitable for multi-overlay multi-time sequence photoetching pattern and fabrication method of mask group

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0027] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0028] Embodiment 1 of the present invention provides a mask set suitable for multi-sequence lithography patterns for multiple overlays, including multiple masks, the number of masks is m+1, m is the number of overlays, in,

[0029] Each mask plate is evenly divided into a plurality of pattern areas, the total area of ​​the pattern areas is equal to the surface area of ​​the mask plate, and the number of pattern areas is at least m+1. In order to highlight the diversification of the mask processing sequence, each mask is evenly divided pattern area, and m is the number of overlays.

[0030] Each pattern area is provided with a light-shielding layer, and a light-transmi...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a mask group suitable for multi-overlay multi-time sequence photoetching pattern and a fabrication method of the mask group. The mask comprises a plurality of masks, the number of the masks is (m+1), m is overlay frequencies, a plurality of pattern regions are uniformly divided on each mask, the total area of the pattern region is equal to the surface area of the mask, the number of pattern regions is at least (m+1), a shading layer is arranged on each pattern region, transmitting patterns are formed on the shading layer, the types of the transmitting patterns are (m+1), the transmitting patterns formed on pattern region at the same position of each mask are different, (m+1) transmitting patterns at the same position of the mask is arranged to be a set of overlay group, and the overlay groups at arbitrary two corresponding positions are different. During multi-overlay process of the mask group, the sequence arrangement mode of different time sequences can be acquired without considering the processing sequence of a pattern structure, the processing flows of different time sequences are facilitated, meanwhile, the number of the masks is saved, and the cost is reduced.

Description

technical field [0001] The invention relates to the technical field of semiconductor device preparation, in particular to a mask plate group and a manufacturing method suitable for multiple overlaying and multi-sequence photolithography patterns. Background technique [0002] Photolithography technology is a technology for constructing semiconductor MOS transistors and circuits on a flat silicon wafer, and is a precise microfabrication technology. [0003] When the existing photolithography process performs multiple overlays, it generally performs processing according to a fixed processing sequence. Take the cross pattern engraved three times as an example, such as figure 1 Four kinds of cross figures (1), (2), (3) and (4) participating in the engraving process three times are shown. Such as figure 2 Four photolithographic patterns after overlaying of cross patterns are shown. Such as image 3 As shown, the mask plate is divided into a, b, c, d. In the process, the ge...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G03F1/56G03F7/00
CPCG03F1/56G03F7/0035Y02P70/50
Inventor 陶智李秋实李海旺谭啸徐天彤余明星
Owner BEIHANG UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products