Wafer corrosion device

Abstract

The invention relates to the technical field of semiconductor manufacturing, in particular to a wafer corrosion device. The wafer corrosion device is applied to wafer surface substance corrosion processing. The wafer corrosion device comprises an inner box, an outer box, a transmission device and an overflowing pump, wherein a detachable cavity with a wafer box containing a plurality of wafers is formed inside the inner box, and a groove matched with a polygonal rotating column is formed in the bottom of the inner box; the outer box and the inner box are arranged at a preset interval, and the outer box completely covers the inner box; the driving end of the transmission device is connected with a driving unit, and the output end of the transmission device is connected with the polygonal rotating column; the overflowing pump is arranged inside the inner box and used for providing pushing force for pushing a corrosion solution contained inside the inner box to overflow into the outer box. When the overflowing pump pushes the corrosion solution to overflow into the outer box, the polygonal rotating column is driven by the transmission device to drive the wafers to rotate in the flowing corrosion solution.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a wafer etching device. Background technique [0002] In the wafer manufacturing process of the semiconductor industry, it is necessary to etch the wafer before ion implantation, diffusion, and photolithography. The common etching is to remove the surface photoresist and remove the surface silicon dioxide oxide layer. After the wafer enters the etching tank , the chemical liquid etches the surface of the wafer to remove excess substances on the surface. [0003] At present, there are two main types of wafer etching devices in the market, one is a single wafer etching device, and the other is a multi-wafer etching device. The single wafer etching device only rotates a single wafer by spraying chemical liquid The wafer is etched, which has the advantage of better corrosion uniformity of the wafer, but the main disadvantages are low efficiency, high consumption ...

AI Technical Summary

Problems solved by technology

[0003] At present, there are two main types of wafer etching devices in the market, one is a single wafer etching device, and the other is a multi-wafer etching device. The single wafer etching device only rotates a single wafer by spraying chemical liquid Wafers are etched, the advantage is that the corrosion uniformity of the wafers is better, but the main disadvantages are low efficiency, large consumption of chemical liquid, and do not use industrial scale production

Therefore, in the industrial production process, multi-chip etching devices are mostly used. In the multi-chip etching device, multiple wafers are put into the wafer cassette and put into the etching tank. During the multi-chip etching process, due to the different concentration of the chemical solution in the tank Uniformity, the temperature of the upper and lower sides of the tank is uneven, and the bubbles generated during the wafer corrosion process adhere, resulting in a large difference in the corrosion uniformity of the wafer surface

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