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Manufacturing method for super-hard resin grinding wheel

A resin grinding wheel, superhard technology, applied in the direction of manufacturing tools, metal processing equipment, grinding/polishing equipment, etc., can solve the upper limit of porosity of resin grinding wheel, uneven distribution of pores of resin grinding wheel, difficulty in uniform mixing of molding materials, etc. problems, to achieve the effects of reduced processing costs, high uniformity of structure, and good grinding performance

Active Publication Date: 2016-02-03
ZHENGZHOU RES INST FOR ABRASIVES & GRINDING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These two methods of "occupancy" to manufacture porous grinding wheels will be limited by the upper limit of the amount of solids, resulting in a limitation of the upper limit of the porosity of the resin grinding wheel; at the same time, the viscosity of the resin liquid is high, which makes it difficult to mix the molding materials evenly. To a certain extent, the pores of the resin grinding wheel are distributed unevenly

Method used

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  • Manufacturing method for super-hard resin grinding wheel
  • Manufacturing method for super-hard resin grinding wheel

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A superhard resin grinding wheel, made of the following raw materials in parts by mass: 18 parts of epoxy resin liquid, 18 parts of thinner, 0.7 parts of coupling agent, 0.8 parts of hollow balls, 55 parts of diamond, and 13 parts of curing agent; The diluent is n-butanol, the diamond is nickel-plated diamond, and the particle size of the diamond is 5 μm.

[0024] The preparation method of described superhard resin emery wheel, comprises the following steps:

[0025] ①Dry the hollow ball in an oven at 80°C for 4 hours, mix it with diamond evenly, and pass it through a 100-mesh sieve;

[0026] ②Stir and heat the epoxy resin solution in a water bath at 70°C for 5 minutes, add a diluent and a coupling agent with a total amount of 30% of the diluent, continue stirring and heating for 6 minutes, and then add the hollow spheres and diamonds obtained in step ①. Mixture, continue stirring and heating for 7 minutes;

[0027] ③Reduce the temperature of the water bath in step ② ...

Embodiment 2

[0032] A superhard resin grinding wheel, made of the following raw materials in parts by mass: 15 parts of epoxy resin liquid, 20 parts of diluent, 0.5 parts of coupling agent, 0.5 parts of hollow balls, 40 parts of diamond, and 10 parts of curing agent; The diluent is n-butanol, the diamond is nickel-plated diamond, and the particle size of the diamond is 4 μm.

[0033] The preparation method of described superhard resin emery wheel, comprises the following steps:

[0034] ①Dry the hollow ball in an oven at 90°C for 2 hours, mix it with diamond evenly, and pass it through a 120-mesh sieve;

[0035] ② Stir and heat the epoxy resin solution in a water bath at 80°C for 2 minutes, add 40% of the total amount of diluent and coupling agent, continue stirring and heating for 10 minutes, then add the hollow spheres and diamonds obtained in step ① The mixture was stirred and heated for 5 minutes;

[0036] ③Reduce the temperature of the water bath in step ② to 60°C, mix the remaining...

Embodiment 3

[0041] A superhard resin grinding wheel, made of the following raw materials in parts by mass: 25 parts of epoxy resin solution, 15 parts of diluent, 1 part of coupling agent, 1 part of hollow ball, 60 parts of diamond, and 15 parts of curing agent; The diluent is n-butanol, the diamond is nickel-plated diamond, and the particle size of the diamond is 8 μm.

[0042] The preparation method of described superhard resin emery wheel, comprises the following steps:

[0043] ①Dry the hollow ball in an oven at 100°C for 0.5h, mix it with diamond evenly and pass it through a 100-mesh sieve;

[0044] ②Stir and heat the epoxy resin solution in a water bath at 75°C for 3 minutes, then add a diluent and a coupling agent with a total amount of 35% of the diluent, continue stirring and heating for 5 minutes, then add the hollow spheres and diamonds obtained in step ①. Mixture, continue stirring and heating for 10 minutes;

[0045]③Reduce the temperature of the water bath in step ② to 56°C...

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Abstract

The invention discloses a manufacturing method for a super-hard resin grinding wheel. The manufacturing method includes the following steps that firstly, hollow spheres are dried for 0.5-4 h in a drying oven at the temperature of 80-100 DEG C and evenly mixed with diamond and then pass a screen with 100-200 meshes; secondly, epoxy resin liquid is stirred in a water bath with the temperature of 70-80 DEG C for 2-5 minutes, then diluent and a coupling agent are added, after stirring heating is conducted continuously for 5-10 minutes, the obtained mixture of the hollow spheres and the diamond in the first step is added, and stirring heating is conducted continuously for 5-10 minutes; thirdly, the temperature of the water bath in the second step is reduced to 55-60 DEG C, the diluent and a curing agent are evenly mixed and then added to sizing obtained in the second step, the obtained mixture is poured into a mold after even mixing is conducted and hardened for 3-8 h under the temperature of 80-90 DEG C, and then curing is conducted; and fourthly, the material cured in the third step is cooled to the room temperature to be demolded, a grinding wheel ring is obtained, machining is conducted, and the super-hard resin grinding wheel is obtained.

Description

technical field [0001] The invention belongs to the technical field of ultra-precision processing of substrates, and in particular relates to a preparation method of a superhard resin grinding wheel. Background technique [0002] With the rapid development of the optoelectronic device industry and microelectronics technology, the processing requirements for hard and brittle crystal substrates such as SiC, GaAs, and single crystal sapphire are becoming more and more stringent. These crystal substrates have high hardness, high brittleness, anisotropy and chemical Good stability, not only requires extremely high processing accuracy, processing efficiency and low processing cost, but also requires high surface quality. The surface roughness of the wafer reaches sub-nanometer level, and there are no micro-cracks or flaws on the surface or sub-surface. Defects and damages such as points, stacking faults, dislocations and distorted layers. At present, the processing technology pro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D18/00
Inventor 惠珍丁玉龙丁春生
Owner ZHENGZHOU RES INST FOR ABRASIVES & GRINDING CO LTD
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