Process for protecting goldfinger and bonding pad in rigid-flex printed circuit board

Abstract

The invention discloses a process for protecting a goldfinger and a bonding pad in a rigid-flex printed circuit board. The process comprises the following steps of S1, respectively carrying out board cutting; S2, carrying out a front procedure; S3, coating the surface of a flexible board with a cover film and carrying out first rapid lamination; S4, coating the goldfinger and the bonding pad of the flexible board with a high-temperature resistant adhesive tape, and carrying out second rapid lamination; S5, carrying out brownification on a copper surface of the flexible board, carrying out lamination on the flexible board, a prepreg and a rigid board, and milling an appearance; S6, removing the high-temperature resistant adhesive tape, and carrying out nickel and gold deposition treatment on a goldfinger region and a bonding pad region which are exposed; and S7, carrying out a post procedure. By coating the high-temperature resistant adhesive tape, the problem that glue residue is remained on the prepreg on the goldfinger region and the bonding region, or the goldfinger and the bonding pad are polluted by other impurities during the lamination process and are difficult to clean is solved, normal surface treatment can be carried out on the goldfinger and the bonding pad after the high-temperature resistant adhesive tape is removed, no glue residue is remained, the production rejection rate is reduced, the product quality is improved, and the production cost is saved.

Description

technical field [0001] The invention belongs to the technical field of printed circuit board production, and relates to a production process of a rigid-flex board, in particular to a process for protecting fingers and welding pads inside a rigid-flex board. Background technique [0002] With the continuous development of electronic technology, especially the continuous improvement of electronic assembly technology, traditional rigid printed circuit boards have gradually been unable to meet the requirements of "light, thin, short and small" electronic products, especially in military industry, medical equipment, mobile phones, The market demand for products such as cameras continues to expand, and the development and research of rigid-flex boards has received widespread attention. Rigid-flex board refers to a printed circuit board that contains one or more rigid areas and flexible areas at the same time. It is composed of rigid boards and flexible boards laminated together in...

AI Technical Summary

Problems solved by technology

[0004] For this reason, the technical problem to be solved by the present invention is that in the production process of the existing rigid-flex board, the inner layer gold fingers and pads are easily contaminated with debris after lamination, and the residual glue of the prepreg is difficult to remove, resulting in inner layer pads Or the quality of the gold fingers is abnormal, so a process for protecting the gold fingers and pads inside the rigid-flex board is proposed