CEM-3 type copper-clad laminated plate base paper manufacturing method
A manufacturing method and technology of laminated boards, which are applied in chemical instruments and methods, lamination, and layered products, etc., can solve the problem of poor tracking resistance, peeling resistance, cracking resistance, etc. of copper-clad laminated board base paper. Poor impact performance, shortened shelf life of adhesive sheets, etc., to achieve the effects of improving peel strength, enhancing adhesiveness and flame retardancy, and reducing curing time
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0066] Add tetrabromobisphenol A and epichlorohydrin into the reaction kettle, stir at room temperature for 25 minutes, heat up to 60°C, add 20% NaOH aqueous solution dropwise, finish the dropwise addition within 30 minutes, and raise the temperature to 70°C after the dropwise addition ℃, reacted for 2h, added distilled water and toluene, stirred until dissolved, separated, and vacuum distilled to obtain the brominated bisphenol A type epoxy resin;
Embodiment 2
[0068] Add tetrabromobisphenol A and epichlorohydrin into the reaction kettle, stir at room temperature for 30 minutes, heat up to 50°C, add 20% NaOH aqueous solution dropwise, finish the dropwise addition within 60 minutes, and raise the temperature to 80°C after the dropwise addition ℃, reacted for 1.5h, added distilled water and toluene, stirred until dissolved, separated, and vacuum distilled to obtain the brominated bisphenol A epoxy resin;
Embodiment 3
[0070] Add tetrabromobisphenol A and epichlorohydrin into the reaction kettle, stir at room temperature for 28 minutes, heat up to 60°C, add 20% NaOH aqueous solution dropwise, and finish the dropwise addition within 50 minutes, then raise the temperature to 75°C ℃, reacted for 2h, added distilled water and toluene, stirred until dissolved, separated, and vacuum distilled to obtain the brominated bisphenol A type epoxy resin;
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com