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Underfill adhesive film, underfill adhesive film with integrated backgrinding tape, underfill adhesive film with integrated dicing tape, and semiconductor device

An underfill and adhesive film technology, which is applied in semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., can solve problems such as voids, difficult to fill bump formation surfaces, etc.

Inactive Publication Date: 2015-11-25
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, in recent years, the pitch of bumps of semiconductor chips has been narrowed. In the filling method using liquid underfill material, it is difficult to fill the unevenness of the bump formation surface, and voids (air bubbles) may be generated.

Method used

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  • Underfill adhesive film, underfill adhesive film with integrated backgrinding tape, underfill adhesive film with integrated dicing tape, and semiconductor device
  • Underfill adhesive film, underfill adhesive film with integrated backgrinding tape, underfill adhesive film with integrated dicing tape, and semiconductor device
  • Underfill adhesive film, underfill adhesive film with integrated backgrinding tape, underfill adhesive film with integrated dicing tape, and semiconductor device

Examples

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Embodiment

[0175] Hereinafter, a preferred embodiment of the present invention will be exemplarily explained in detail. However, as long as there are no particular limitations on the materials and compounding amounts described in the examples, they are not intended to limit the scope of the present invention to only these.

[0176] Hereinafter, various components used in Examples and Comparative Examples will be collectively explained.

[0177] Acrylic resin: Parachron W-197CM manufactured by Negami Kogyo Co., Ltd. (acrylic ester polymer mainly composed of ethyl acrylate and methyl methacrylate, Mw: 400000)

[0178] Epoxy resin 1: JER1004 manufactured by Mitsubishi Chemical Corporation (bisphenol A epoxy resin, Mn: 1650, epoxy equivalent: 875 to 975 g / eq)

[0179] Epoxy resin 2: jER828 manufactured by Mitsubishi Chemical Corporation (bisphenol A epoxy resin, Mn: 370, epoxy equivalent: 184 to 194 g / eq)

[0180] Phenolic resin 1: MEH-7851SS manufactured by Meiwa Chemical Co., Ltd. (resin containing...

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Abstract

Provided is an underfill adhesive film which can increase the glass transition temperature without diminishing flexibility. The present invention pertains to an underfill adhesive film which includes a resin component comprising an epoxy resin with a number average molecular weight of 600 or less, a phenolic resin with a number average molecular weight of over 500, and an elastomer, the content of the epoxy resin in the resin component being 5-50 wt% and the content of the phenolic resin being 5-50 wt%.

Description

Technical field [0001] The present invention relates to an adhesive film for underfill, a tape-integrated adhesive film for underfill for back grinding, an adhesive film for dicing tape-integrated underfill, and a semiconductor device. Background technique [0002] In the manufacture of flip-chip mounted semiconductor packages, after the semiconductor chip and the substrate are electrically connected, a space between the semiconductor chip and the substrate may be filled with a liquid underfill material (Patent Document 1). [0003] However, in recent years, the narrowing of the bump pitch of semiconductor chips has been progressing. In the filling method using a liquid underfill material, it is difficult to fill the unevenness of the bump formation surface, and voids (bubbles) may be generated. Therefore, a technique of filling the space between the semiconductor chip and the substrate with a sheet-like underfill material has been proposed (Patent Document 2). [0004] Prior art li...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/60B32B27/38B32B27/42C09J7/00C09J121/00C09J161/04C09J163/00H01L21/301H01L21/52C09J7/10
CPCB32B27/38B32B7/12B32B27/08B32B27/20B32B27/308B32B27/42B32B2264/10B32B2307/718B32B2405/00B32B2457/00C08G14/04C09J7/00C09J121/00C09J133/10C09J161/06C09J161/34C09J163/00C09J2201/61C09J2203/326C09J2421/00C09J2461/00C09J2463/00H01L21/563H01L23/295H01L24/14H01L24/27H01L2224/73104H01L2224/83191H01L24/29H01L2224/14181H01L2224/16145H01L2224/16225H01L2224/27436H01L2224/2929H01L2224/32225H01L2224/73204H01L2224/81193H01L2924/00014H01L21/6836H01L2221/68327H01L2221/68336H01L2221/6834H01L2221/68377H01L2221/68381C09J7/10C08L21/00C08L33/10C08L61/00C08L63/00C09J133/12C09J2301/304H01L2224/13099H01L2924/00C08L61/04C08K3/36H01L23/3142
Inventor 盛田浩介高本尚英花园博行福井章洋
Owner NITTO DENKO CORP
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