Promoter for mechanical plating of copper and copper alloy and use method of promoter

Abstract

The invention discloses a promoter for mechanical plating of copper and copper alloy, and belongs to the technical field of steel product surface copper plating. The promoter is composed of 0.5%-2% of diatomite, 1%-2% of sodium gluconate, 0.5%-1% of triethanolamine, 1%-3% of ammonium chloride, 78%-83% of tin salt, 5%-8% of ammonium dihydrogen phosphate, 0.5%-2% of boric acid and 5%-10% of polyethylene glycol; all the substances are mixed to form powder, and in use, 40% of the powder promoter, 2%-5% of OP-10, 5%-10% of phosphoric acid and the balance water are prepared to form an aqueous solution according to a certain adding sequence. The promoter is used for forming copper or copper alloy plating on the surface of a steel product through a mechanical plating method, and in the plating process, the usage amount (the unit is milliliter) of the promoter aqueous solution is 8-10 times the surface area (the unit is square meter) of a steel product to be plated. Through the promoter, rapid deposition of copper or copper alloy powder on the surface of the steel product can be achieved, and the copper or copper alloy plating which is smooth in surface and even in color is obtained.

Description

technical field [0001] The invention relates to an accelerator for mechanical copper plating and copper alloy, which belongs to the technical field of surface plating of iron and steel materials and is used for mechanical copper plating and copper alloy on the surface of iron and steel parts. Background technique [0002] Mechanical plating technology is a new type of green surface protection technology that entered industrial application in developed countries such as Europe and the United States in the 1960s. It has the characteristics of high efficiency, low cost, low energy consumption, simple process, and low environmental pollution. In recent years, with the increasing pressure of environmental protection and the closure of small electroplating factories, mechanical plating technology has been favored by the surface treatment industry. However, some problems have also been exposed in the development process, such as the single type of coating, especially it is difficul...

AI Technical Summary

Problems solved by technology

The main shape layer material used in mechanical copper plating and copper alloy is copper powder or brass powder or bronze powder. Compared with zinc and zinc alloy powder, divalent copper ions are more likely to be reduced and deposited on the surface of steel, but metal copper is easy to deposit. Oxidation, the reduction deposition layer of divalent copper ions is extremely unstable, easy to change color or even black, and the standard electrode potential of metal copper is much more positive than that of zinc, so from the theoretical and practical analysis of conventional mechanical galvanizing deposition accelerators (or It is the accelerator used in the thickening process of mechanical galvanized coating) is no longer suitable for mechanical copper plating and copper alloy coating process