Reinforcing sheet and process for producing semiconductor device through secondary mounting
A manufacturing method, semiconductor technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, chemical instruments and methods, etc., can solve problems such as increased injection volume, wider interval, difficulty in adjusting sealing resin injection position and injection volume, etc.
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no. 1 Embodiment approach
[0042] In the first embodiment, a description will be given of a method in which a package in which a semiconductor chip is flip-chip mounted on an interposer is used as a primary mounted semiconductor device, and backside grinding is performed as a process for the primary mounted semiconductor device.
[0043] [Process (A)]
[0044] In the step (A), a predetermined reinforcing sheet is bonded to the first main surface of the primary semiconductor device. Hereinafter, first, the reinforcing sheet will be described, and then, the manufacturing process of the secondary mounting semiconductor device using the reinforcing sheet will be described.
[0045] (enhancement sheet)
[0046] Such as figure 1 As shown, the reinforcing sheet 8 includes a base material layer 1a, an adhesive layer 1b, and a thermosetting resin layer 2 in this order. In this embodiment, the base material layer 1a and the adhesive layer 1b comprise the tape 1 for back surface grinding. Additionally, if fig...
no. 2 Embodiment approach
[0138] The primary mounting semiconductor device used in this embodiment has a target thickness, so the grinding step is omitted. Therefore, as the reinforcing sheet in the second embodiment, a reinforcing sheet including a dicing tape and a thermosetting resin layer laminated on the dicing tape is used.
[0139] [Process (A)]
[0140] In the step (A), a predetermined reinforcing sheet is bonded to the first main surface 3 a of the primary semiconductor device 10 . The reinforcing sheet has a dicing tape 21 and a thermosetting resin layer 2 laminated on the dicing tape 21 (see Figure 3A ). The dicing tape 21 includes a base material layer 21a and an adhesive layer 21b laminated on the base material layer 21a. In addition, the thermosetting resin layer 2 is laminated on the adhesive layer 21b. As the base layer 21a, the adhesive layer 21b, and the thermosetting resin layer 2 of such a dicing tape 21, the same layers as the base layer 1a, the adhesive layer 1b, and the ther...
no. 3 Embodiment approach
[0145] In the first embodiment, as the configuration of the reinforcing sheet, the mode including the base material layer, the adhesive layer, and the thermosetting resin layer was described. In the third embodiment, the configuration of the base material layer and the adhesive layer A reinforcing sheet further provided with an intermediate layer made of a thermoplastic resin will be described. A predetermined semiconductor device can be manufactured through the same steps as in the first embodiment except that the reinforcing sheet is provided with an intermediate layer.
[0146] Such as Figure 4 As shown, the reinforcing sheet 38 includes a base material layer 31a, an intermediate layer 31c, an adhesive layer 31b, and a thermosetting resin layer 2 in this order. When the size of the protruding electrodes increases, it is necessary to increase the thickness of the thermosetting resin layer and the adhesive layer in order to realize the penetration of the protruding electrod...
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