Teflon radiating material doped with nanosized tin for LED light source and preparation method thereof

Abstract

The invention relates to LED radiating materials, in particular to a Teflon radiating material doped with nanosized tin for an LED light source and a preparation method thereof. The Teflon radiating material doped with the nanosized tin is composed of, by weight, 5-8 parts of 400-600-mesh gamma aluminium oxide micro powder, 2-4 parts of polytrifluorochloroethylene, 0.1-0.2 part of trisodium phosphate, 2-3 parts of the nanosized tin, 1-2 parts of normal-temperature bubble-free surfactant, 30-40 parts of water, 3-5 parts of sodium silicate, 4-5 parts of 200-300-mesh aluminosilicates, 4-5 parts of silica sol with a solid content of 15-20%, 1-2 parts of sodium hexametaphosphate, 20-25 parts of aluminium nitride micro powder of 400-600 meshes, 40-50 parts of 200-300-mesh Teflon micro powder and 2-3 parts of auxiliaries. The prepared Teflon radiating material doped with the nanosized tin has the advantages of efficient, uniform and stable thermal conductivity, environment corrosion resistance, good thermal stability, the clean surface, soiling resistance, safety and insulation. The Teflon radiating material doped with the nanosized tin is easy to process and cut, and is an environment-friendly efficient LED lamp radiating material.

Description

technical field [0001] The invention relates to an LED heat dissipation material, in particular to a polytetrafluoroethylene-based doped nano-tin heat dissipation material for an LED light source and a preparation method thereof. Background technique [0002] LED is the abbreviation of light-emitting diode. It is a semiconductor electronic component that converts electrical energy into light energy. It has the advantages of small size, long life, low power consumption, fast response, high luminous efficiency, energy saving and environmental protection. It is recognized in the industry As the most competitive product to replace traditional light sources, it has also been widely used in real life. There are still many problems in current LED products, among which heat dissipation has always been the top priority. Common heat dissipation materials are mostly high thermal conductivity metals. , high thermal conductivity inorganic materials, and these materials are compounded and...

AI Technical Summary

Problems solved by technology

[0002] LED is the abbreviation of light-emitting diode. It is a semiconductor electronic component that converts electrical energy into light energy. It has the advantages of small size, long life, low power consumption, fast response, high luminous efficiency, energy saving and environmental protection. It is recognized in the industry As the most competitive product to replace traditional light sources, it has also been widely used in real life. There are still many problems in current LED products, among which heat dissipation has always been the top priority. Common heat dissipation materials are mostly high thermal conductivity metals. , high thermal conductivity inorganic materials, and these materials are compounded and sintered. These materials have disadvantages such as difficult cutting and forming, high cost, and easy to be corroded by the environment. Excellent heat dissipation effect, and can improve the environmental adaptability of the material to achieve efficient and stable performance